SCHEMBL1720396

SCHEMBL1720396

NCCN(CO)CO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13683356 0.84
SCHEMBL2058185 0.82
SCHEMBL1720701 0.80
SCHEMBL18432801 0.80
Monoethanolamine SCHEMBL21635468 0.79 ALDH1A1 (0.57)
SCHEMBL1720368 0.78 CHRM2 (0.43)
SCHEMBL1062510 0.76 LCK (0.48)
SCHEMBL33394 0.76 LCK (0.48)
SCHEMBL1719574 0.76 TDP1 (0.41)
SCHEMBL62953 0.76 ALDH1A1 (0.44)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119639328-A Preparation method of antibacterial wear-resistant aqueous polyurethane coating 安徽佳景美新材料有限公司 2025-03-18 CN claimed
CN-116180083-A Etching liquid for MTD-Cu-MTD of liquid crystal display panel and preparation method thereof 江苏和达电子科技有限公司 2023-05-30 CN claimed
CN-109576688-B Chemical nickel plating solution containing soapnut saponin hydrolysate, nickel plating method and nickel plated part 浙江外国语学院 2022-02-11 CN claimed
CN-110923713-B Etching liquid for copper-molybdenum and alloy films and preparation method thereof 成都中电熊猫显示科技有限公司 2020-12-08 CN claimed
CN-110923713-A Etching liquid for copper-molybdenum and alloy films and preparation method thereof 成都中电熊猫显示科技有限公司 2020-03-27 CN claimed
CN-107190251-B A kind of gold plating liquid and preparation method thereof 广东东硕科技有限公司 2018-11-16 CN claimed
CN-107190251-A A kind of gold plating liquid and preparation method thereof 广东东硕科技有限公司 2017-09-22 CN claimed
EP-1031884-B1 Resist stripping agent and process of producing semiconductor devices using the same MITSUBISHI GAS CHEMICAL CO (JP) 2012-01-11 EP claimed
US-7968507-B2 Composition for stripping and stripping method SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-06-28 US claimed
US-20090084406-A1 Composition for stripping and stripping method SAMSUNG ELECTRONICS CO., LTD. 2009-04-02 US claimed
US-20030186175-A1 RESIST STRIPPING AGENT AND PROCESS OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME IKEMOTO KAZUTO (JP) 2003-10-02 US claimed
EP-1031884-A2 Resist stripping agent and process of producing semiconductor devices using the same MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2000-08-30 EP claimed
CN-120464310-B Preparation method of antibacterial wear-resistant aqueous polyurethane coating 安徽佳景美新材料有限公司 2025-09-26 CN disclosed
CN-120464310-A Preparation method of antibacterial wear-resistant aqueous polyurethane coating 安徽佳景美新材料有限公司 2025-08-12 CN disclosed
CN-119639328-A Preparation method of antibacterial wear-resistant aqueous polyurethane coating 安徽佳景美新材料有限公司 2025-03-18 CN disclosed
CN-119639328-A Preparation method of antibacterial wear-resistant aqueous polyurethane coating 安徽佳景美新材料有限公司 2025-03-18 CN disclosed
EP-0171276-A2 Process for inhibiting peptide carbamylation ELI LILLY AND COMPANY (US) 1986-02-12 EP disclosed
EP-0055632-B1 MODIFIED EPOXY RESIN COMPOSITION AND PROCESS FOR THE PREPARATION THEREOF SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1985-09-11 EP disclosed
US-4463134-A WITH MODIFIED CONJUGATED DIENE POLYMER OR COPOLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1984-07-31 US disclosed
EP-0055632-A1 Modified epoxy resin composition and process for the preparation thereof SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1982-07-07 EP disclosed