⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11470566 | 0.94 | NFKB1 (0.35) | — | |
| SCHEMBL1720368 | 0.91 | CHRM2 (0.43) | — | |
| SCHEMBL17126970 | 0.84 | — | — | |
| SCHEMBL1720396 | 0.80 | — | — | |
| SCHEMBL62173 | 0.79 | NFKB1 (0.46) | — | |
| SCHEMBL1720051 | 0.79 | EYA2 (0.30) | — | |
| SCHEMBL1720709 | 0.79 | EYA2 (0.30) | — | |
| SCHEMBL62798 | 0.79 | TSHR (0.39) | — | |
| SCHEMBL1674639 | 0.79 | TSHR (0.39) | — | |
| SCHEMBL64887 | 0.79 | TSHR (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116180083-A | Etching liquid for MTD-Cu-MTD of liquid crystal display panel and preparation method thereof | 江苏和达电子科技有限公司 | 2023-05-30 | — | — | CN | claimed |
| CN-107190251-B | A kind of gold plating liquid and preparation method thereof | 广东东硕科技有限公司 | 2018-11-16 | — | — | CN | claimed |
| CN-107190251-A | A kind of gold plating liquid and preparation method thereof | 广东东硕科技有限公司 | 2017-09-22 | — | — | CN | claimed |
| EP-1031884-B1 | Resist stripping agent and process of producing semiconductor devices using the same | MITSUBISHI GAS CHEMICAL CO (JP) | 2012-01-11 | — | — | EP | claimed |
| US-7968507-B2 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-06-28 | — | — | US | claimed |
| US-20090084406-A1 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. | 2009-04-02 | — | — | US | claimed |
| US-6638694-B2 | Mixtures of amines, water soluble solvents and corrosion resistance agents, used for removing photoresist films and residues after etching semiconductor integrated circuits or liquid crystal displays | MITSUBISHI GAS CHEMICAL COMPANY, INC (JP) | 2003-10-28 | — | — | US | claimed |
| US-20030186175-A1 | RESIST STRIPPING AGENT AND PROCESS OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME | IKEMOTO KAZUTO (JP) | 2003-10-02 | — | — | US | claimed |
| EP-1031884-A2 | Resist stripping agent and process of producing semiconductor devices using the same | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2000-08-30 | — | — | EP | claimed |
| WO-2024149370-A1 | COMPOUND, PREPARATION METHOD, AND LIPID NANOPARTICLES AND PHARMACEUTICAL COMPOSITION THEREOF | 苏州慧疗生物医药科技有限公司 | 2024-07-18 | — | — | WO | disclosed |
| WO-2023179497-A1 | LIPID COMPOUND, LIPID CARRIER BASED ON LIPID COMPOUND, NUCLEIC ACID LIPID NANOPARTICLE COMPOSITION AND PHARMACEUTICAL FORMULATION | 苏州科锐迈德生物医药科技有限公司 | 2023-09-28 | — | — | WO | disclosed |
| CN-116180083-A | Etching liquid for MTD-Cu-MTD of liquid crystal display panel and preparation method thereof | 江苏和达电子科技有限公司 | 2023-05-30 | — | — | CN | disclosed |
| CN-107190251-B | A kind of gold plating liquid and preparation method thereof | 广东东硕科技有限公司 | 2018-11-16 | — | — | CN | disclosed |
| CN-107190251-A | A kind of gold plating liquid and preparation method thereof | 广东东硕科技有限公司 | 2017-09-22 | — | — | CN | disclosed |
| EP-1414915-A1 | PIGMENT DISPERSANT FOR CATHODIC ELECTROCOATING COMPOSITION | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2004-05-06 | — | — | EP | disclosed |
| US-6638694-B2 | Mixtures of amines, water soluble solvents and corrosion resistance agents, used for removing photoresist films and residues after etching semiconductor integrated circuits or liquid crystal displays | MITSUBISHI GAS CHEMICAL COMPANY, INC (JP) | 2003-10-28 | — | — | US | disclosed |
| US-20030186175-A1 | RESIST STRIPPING AGENT AND PROCESS OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME | IKEMOTO KAZUTO (JP) | 2003-10-02 | — | — | US | disclosed |
| US-20030036584-A1 | Pigment dispersant for cathodic electrocoating compositions | E. I. DU PONT DE NEMOURS AND COMPANY | 2003-02-20 | — | — | US | disclosed |
| WO-2003014235-A1 | PIGMENT DISPERSANT FOR CATHODIC ELECTROCOATING COMPOSITION | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2003-02-20 | — | — | WO | disclosed |
| EP-1031884-A2 | Resist stripping agent and process of producing semiconductor devices using the same | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2000-08-30 | — | — | EP | disclosed |