Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | WDR5 | P61964 | 1/20 | 0.52 |
| ▸ | PRSS1 | P07477 | 2/20 | 0.47 |
| ▸ | PRSS2 | P07478 | 2/20 | 0.47 |
| ▸ | PRSS3 | P35030 | 2/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.43 |
| ▸ | F2 | P00734 | 1/20 | 0.42 |
| ▸ | F10 | P00742 | 1/20 | 0.42 |
| ▸ | F12 | P00748 | 1/20 | 0.42 |
| ▸ | F7 | P08709 | 1/20 | 0.42 |
| ▸ | F3 | P13726 | 1/20 | 0.42 |
| ▸ | PKM | P14618 | 1/20 | 0.42 |
| ▸ | BLM | P54132 | 1/20 | 0.41 |
| ▸ | C1S | P09871 | 1/20 | 0.39 |
| ▸ | RECQL | P46063 | 1/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.39 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | MMP3 | P08254 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Biphenyl SCHEMBL8158967 | 0.80 | WDR5 (0.56) | WDR5PRSS1PRSS2PRSS3ALDH1A1 | |
| Biphenyl SCHEMBL212324 | 0.79 | WDR5 (0.67) | WDR5PRSS1PRSS2PRSS3ALDH1A1 | |
| Biphenyl SCHEMBL720475 | 0.76 | WDR5 (0.64) | WDR5PRSS1PRSS2PRSS3ALDH1A1 | |
| Biphenyl SCHEMBL2387223 | 0.76 | WDR5 (0.64) | WDR5PRSS1PRSS2PRSS3ALDH1A1 | |
| Biphenyl SCHEMBL9113005 | 0.76 | WDR5 (0.64) | WDR5PRSS1PRSS2PRSS3ALDH1A1 | |
| Biphenyl SCHEMBL10648446 | 0.76 | WDR5 (0.64) | WDR5PRSS1PRSS2PRSS3ALDH1A1 | |
| Biphenyl SCHEMBL8419917 | 0.76 | MEN1 (0.47) | WDR5ALDH1A1BLMRECQLKMT2A | |
| Biphenyl SCHEMBL28765738 | 0.76 | WDR5 (0.42) | WDR5PRSS1PRSS2PRSS3ALDH1A1 | |
| SCHEMBL2016755 | 0.76 | — | — | |
| Biphenyl SCHEMBL28594776 | 0.74 | WDR5 (0.61) | WDR5PRSS1PRSS2PRSS3ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240234226-A9 | CURABLE COMPOSITION FOR INKJET AND AIR CAVITY FORMATION, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | SEKISUI CHEMICAL CO., LTD. (JP) | 2024-07-11 | — | — | US | disclosed |
| US-20240136239-A1 | CURABLE COMPOSITION FOR INKJET AND AIR CAVITY FORMATION, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | SEKISUI CHEMICAL CO., LTD. (JP) | 2024-04-25 | — | — | US | disclosed |
| EP-3222692-B1 | INKJET PHOTO- AND HEAT-CURABLE ADHESIVE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND ELECTRONIC PART | SEKISUI CHEMICAL CO LTD (JP) | 2023-07-12 | — | — | EP | disclosed |
| US-20220098419-A1 | METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT | SEKISUI CHEMICAL CO LTD (JP) | 2022-03-31 | — | — | US | disclosed |
| US-11220604-B2 | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component | SEKISUI CHEMICAL CO., LTD. (JP) | 2022-01-11 | — | — | US | disclosed |
| US-10961411-B2 | Inkjet adhesive, manufacturing method for semiconductor device, and electronic component | SEKISUI CHEMICAL CO., LTD. (JP) | 2021-03-30 | — | — | US | disclosed |
| EP-3073520-B1 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT | SEKISUI CHEMICAL CO LTD (JP) | 2019-08-28 | — | — | EP | disclosed |
| EP-3249024-B1 | INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | SEKISUI CHEMICAL CO LTD (JP) | 2019-08-28 | — | — | EP | disclosed |
| US-20190092963-A1 | INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | SEKISUI CHEMICAL CO LTD (JP) | 2019-03-28 | — | — | US | disclosed |
| US-10202519-B2 | Inkjet adhesive, manufacturing method for semiconductor device, and electronic component | SEKISUI CHEMICAL CO., LTD. (JP) | 2019-02-12 | — | — | US | disclosed |
| EP-3249022-A1 | INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Sekisui Chemical Co., Ltd. (JP) | 2017-11-29 | — | — | EP | disclosed |
| EP-3222692-A1 | INKJET PHOTO- AND HEAT-CURABLE ADHESIVE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND ELECTRONIC PART | Sekisui Chemical Co., Ltd. (JP) | 2017-09-27 | — | — | EP | disclosed |
| US-20170233615-A1 | INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | SEKISUI CHEMICAL CO., LTD. (JP) | 2017-08-17 | — | — | US | disclosed |
| US-20170233599-A1 | INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | SEKISUI CHEMICAL CO., LTD. (JP) | 2017-08-17 | — | — | US | disclosed |
| US-20170158922-A1 | INKJET PHOTO- AND HEAT-CURABLE ADHESIVE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND ELECTRONIC PART | SEKISUI CHEMICAL CO., LTD. (JP) | 2017-06-08 | — | — | US | disclosed |
| EP-3073520-A1 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT | Sekisui Chemical Co., Ltd. (JP) | 2016-09-28 | — | — | EP | disclosed |
| EP-3067124-A1 | METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT | Sekisui Chemical Co., Ltd. (JP) | 2016-09-14 | — | — | EP | disclosed |
| US-9337019-B2 | Method for manufacturing electronic component, and electronic component | SEKISUI CHEMICAL CO., LTD. (JP) | 2016-05-10 | — | — | US | disclosed |
| US-20160049297-A1 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT | SEKISUI CHEMICAL CO., LTD. (JP) | 2016-02-18 | — | — | US | disclosed |
| US-20160046813-A1 | METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT | SEKISUI CHEMICAL CO., LTD. (JP) | 2016-02-18 | — | — | US | disclosed |