Biphenyl

Biphenyl

SCHEMBL8158967

N=C(N)NC(=N)N.c1ccc(-c2ccccc2)cc1

nearest known ligand 0.56

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
WDR5 P61964 1/20 0.56
PRSS1 P07477 2/20 0.50
PRSS2 P07478 2/20 0.50
PRSS3 P35030 2/20 0.50
ALDH1A1 P00352 1/20 0.47
F2 P00734 1/20 0.46
F10 P00742 1/20 0.46
F12 P00748 1/20 0.46
F7 P08709 1/20 0.46
F3 P13726 1/20 0.46
PKM P14618 1/20 0.46
BLM P54132 1/20 0.44
C1S P09871 1/20 0.42
RECQL P46063 1/20 0.42
KMT2A Q03164 1/20 0.42
TAAR1 Q96RJ0 2/20 0.42
CYP3A4 P08684 1/20 0.42
HSD17B10 Q99714 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
MMP3 P08254 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Biphenyl SCHEMBL212324 0.83 WDR5 (0.67) WDR5PRSS1PRSS2PRSS3ALDH1A1
Biguanide SCHEMBL28864824 0.82 PRSS1 (0.48) WDR5PRSS1PRSS2PRSS3F2
Biphenyl SCHEMBL720475 0.80 WDR5 (0.64) WDR5PRSS1PRSS2PRSS3ALDH1A1
Biphenyl SCHEMBL2387223 0.80 WDR5 (0.64) WDR5PRSS1PRSS2PRSS3ALDH1A1
Biphenyl SCHEMBL10648446 0.80 WDR5 (0.64) WDR5PRSS1PRSS2PRSS3ALDH1A1
Biphenyl SCHEMBL9113005 0.80 WDR5 (0.64) WDR5PRSS1PRSS2PRSS3ALDH1A1
Biphenyl SCHEMBL17498340 0.80 WDR5 (0.52) WDR5PRSS1PRSS2PRSS3ALDH1A1
Toluene SCHEMBL27403280 0.80 LMNA (0.52) WDR5PRSS1PRSS2PRSS3F2
Chlorobenzene SCHEMBL27648080 0.80 TSHR (0.52) WDR5PRSS1PRSS2PRSS3F2
Biphenyl SCHEMBL16703051 0.80 WDR5 (0.42) WDR5PRSS1PRSS2PRSS3ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122012048-A Composite resin plugging composition, and preparation method and application thereof 中国石油化工股份有限公司 2026-05-12 CN claimed
CN-117264377-A Low-viscosity high-heat-conductivity epoxy resin composition and preparation method thereof 中欧电子材料国际创新中心(合肥)有限公司 2023-12-22 CN claimed
US-20170121520-A1 DIELECTRIC COMPOSITE MATERIAL FOR FINGERPRINT SENSOR INDUCTION LAYER AND PREPARATION METHOD THEREOF TECORE SYNCHEM INC. 2017-05-04 US claimed
CN-105693141-A Method for preparing dielectric composite material for induction layer of fingerprint sensor 天津德高化成新材料股份有限公司 2016-06-22 CN claimed
CN-104194271-A Dielectric composite material for fingerprint sensor induction layer and preparation method thereof TECORE SYNCHEM INC 2014-12-10 CN claimed
CN-102675613-B Nitrogen-containing composite modified polyurethane polyol, as well as preparation method and application thereof ZHEJIANG HUAFENG NEW MATERIAL CO LTD 2013-08-21 CN claimed
CN-102675613-A Nitrogen-containing composite modified polyurethane polyol, as well as preparation method and application thereof ZHEJIANG HUAFENG NEW MATERIAL CO LTD 2012-09-19 CN claimed
CN-101139510-A Epoxide-resin rubber adhesive and preparation method thereof UNIV WUHAN TECH (CN) 2008-03-12 CN claimed
CN-1269819-A Food cleaning compositions containing cyclodextrin PROCTER & GAMBLE (US) 2000-10-11 CN claimed
JP-1187707-A None JP disclosed
CN-122012048-A Composite resin plugging composition, and preparation method and application thereof 中国石油化工股份有限公司 2026-05-12 CN disclosed
CN-114262922-B Processing technology of aluminum profile with high corrosion resistance 广东润华轻合金有限公司 2024-06-18 CN disclosed
CN-117264377-A Low-viscosity high-heat-conductivity epoxy resin composition and preparation method thereof 中欧电子材料国际创新中心(合肥)有限公司 2023-12-22 CN disclosed
CN-114262922-A Processing technology of aluminum profile with high corrosion resistance 广东润华轻合金有限公司 2022-04-01 CN disclosed
CN-1269819-A Food cleaning compositions containing cyclodextrin PROCTER & GAMBLE (US) 2000-10-11 CN disclosed
US-6124023-A PAPER- OR FABRIC-LIKE SUBSTRATE IMPREGNATED WITH AN EPOXY RESIN CONTAINING RUBBER, AND/OR FILLER, SURFACE(S) OF THE IMPREGNATED PAPER OR FABRIC ROUGHENED WITH CHEMICALS OR WITH A PLASMA; HEAT RESISTANCE, DIELECTRIC, BONDING STRENGTH AJINOMOTO CO., INC. (JP) 2000-09-26 US disclosed
EP-0844272-A2 Prepreg for laminate and process for producing printed wiring-board using the same Ajinomoto Co., Ltd. (JP) 1998-05-27 EP disclosed
WO-1997011105-A1 EPOXY RESIN COMPOSITION FOR ELECTROLAMINATES HAVING ARYL SUBSTITUTED GUANIDINE AND/OR BIGUANIDE AS CROSS-LINKING AGENT AKZO NOBEL N.V. (NL) 1997-03-27 WO disclosed
CN-1065280-A COMPOSITIONS OF CUPRIC ALLOY ASAHI CHEMICAL IND (JP) 1992-10-14 CN disclosed
JP-H01187707-A COMPOSITION OF CONDUCTIVE RESIN PASTE SUMITOMO METAL MINING CO LTD 1989-07-27 JP disclosed