Known targets — ChEMBL curated mechanism
ABCC9ABL1ACEACHEACVR1ADORA1ADORA2AADORA2BADORA3ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2ADRB3AGTR1ALOX5ATP4AATP4BBCRBTKCACNA1ACACNA1BCACNA1CCACNA1DCACNA1ECACNA1FCACNA1GCACNA1HCACNA1ICACNA1SCACNA2D1CACNA2D2CACNA2D3CACNA2D4CACNB1CACNB2CACNB3CACNB4CACNG1CACNG2CACNG3CACNG4CACNG5CACNG6CACNG7CACNG8CALCRLCFBCHRM1CHRM2CHRM3CHRM4CHRM5CHRNA1CHRNB1CHRNDCHRNECHRNGCRBNCUL4ACXCR1CXCR2DDB1DDCDHFRDPP4DRD2DRD3DRD4EGFRERBB2ERBB4ESR1ESR2FDPSFKBP1AFLT1FLT3FLT4GARTGHSRGRIA1GRIA2GRIA3GRIA4GRIK1GRIK2GRIK3GRIK4GRIK5GRIN2AGSK3AGSK3BHDAC1HDAC10HDAC11HDAC2HDAC3HDAC4HDAC5HDAC6HDAC7HDAC8HDAC9HRH1HTR1AHTR1BHTR1DHTR1EHTR1FHTR2AHTR2BHTR2CHTR3AHTR3BHTR3CHTR3DHTR3EHTR4HTR5AHTR6HTR7IDH1IDH2IMPA1ITGA2BITGB3JAK1JAK2JAK3KCNJ11KCNK3KCNK9KDRKITMEN1METMMP1MMP13MMP7MMP8NANOD2NS5bODC1OPG057OPRD1OPRK1OPRM1PPARP1PARP2PDE3APDE3BPDE4APDE4BPDE4CPDE4DPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PKLRPPARDPPATPTGS1PTGS2RBX1ROCK1ROCK2RRM1RRM2RRM2BSCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASCNN1ASCNN1BSCNN1GSIGMAR1SLC10A2SLC5A2SLC6A2SLC6A3SLC6A4SLC9A3SYKTACR1THRATHRBTOP1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYK2TYMSVDRampCblablaT-3blaT-4blaT-5blaT-6blaUOE-1dacAdacBdacCfolAfolPftsIgyrAgyrBileSmecAmrcAmrcBmrdAparCparEpbp2pbp4pbpApbpFrplArplBrplCrplDrplErplFrplIrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmE2rpmFrpmGrpmG1rpmG2rpmG3rpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUthyAykgMykgO
The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Water SCHEMBL28256045 | 1.00 | — | — | |
| Water SCHEMBL27325879 | 0.87 | — | — | |
| Water SCHEMBL28019874 | 0.87 | — | — | |
| Ammonia Solution, Strong SCHEMBL28298399 | 0.87 | — | — | |
| Water SCHEMBL6556181 | 0.87 | — | — | |
| Water SCHEMBL8161917 | 0.87 | — | — | |
| Water SCHEMBL25376347 | 0.82 | — | — | |
| Water SCHEMBL251541 | 0.82 | — | — | |
| Water SCHEMBL15756782 | 0.82 | — | — | |
| Water SCHEMBL9043508 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113249035-B | Chemical mechanical polishing solution and application thereof | 长春长光圆辰微电子技术有限公司 | 2024-05-24 | — | — | CN | claimed |
| CN-113249035-A | Chemical mechanical polishing liquid and application thereof | 中国科学院长春光学精密机械与物理研究所 | 2021-08-13 | — | — | CN | claimed |
| US-20240234351-A9 | ELECTRICAL CONNECTION AND FORMING METHOD THEREOF | NATIONAL YANG MING CHIAO TUNG UNIVERSITY (TW) | 2024-07-11 | — | — | US | disclosed |
| CN-118002126-B | Titanium dioxide hollow sphere loaded nano copper photocatalyst and preparation method and application thereof | 西南交通大学 | 2024-06-14 | — | — | CN | disclosed |
| CN-115709065-B | Catalyst for preparing ethylene glycol by hydrogenating dimethyl oxalate, and preparation method and application thereof | 西安凯立新材料股份有限公司 | 2024-06-07 | — | — | CN | disclosed |
| CN-113249035-B | Chemical mechanical polishing solution and application thereof | 长春长光圆辰微电子技术有限公司 | 2024-05-24 | — | — | CN | disclosed |
| CN-118002126-A | Titanium dioxide hollow sphere loaded nano copper photocatalyst and preparation method and application thereof | 西南交通大学 | 2024-05-10 | — | — | CN | disclosed |
| CN-115383343-B | Sn-based lead-free composite solder based on core-shell structure reinforced phase reinforcement | 北京工业大学 | 2024-05-10 | — | — | CN | disclosed |
| US-20240136313-A1 | ELECTRICAL CONNECTION AND FORMING METHOD THEREOF | NATIONAL YANG MING CHIAO TUNG UNIV (TW) | 2024-04-25 | — | — | US | disclosed |
| US-11738366-B2 | Method of coating an object | THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) | 2023-08-29 | — | — | US | disclosed |
| US-11628467-B2 | Selective coating of a structure | THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) | 2023-04-18 | — | — | US | disclosed |
| EP-1485439-A4 | IMPROVED CHEMICAL-MECHANICAL POLISHING SLURRY FOR POLISHING OF COPPER OR SILVER FILMS | UNIV FLORIDA (US) | 2005-10-12 | — | — | EP | disclosed |
| EP-1485439-A1 | IMPROVED CHEMICAL-MECHANICAL POLISHING SLURRY FOR POLISHING OF COPPER OR SILVER FILMS | UNIVERSITY OF FLORIDA (US) | 2004-12-15 | — | — | EP | disclosed |
| US-6821309-B2 | APPLYING SLURRY TO SOFT SURFACE LAYER | UNIVERSITY OF FLORIDA | 2004-11-23 | — | — | US | disclosed |
| WO-2003072670-A1 | IMPROVED CHEMICAL-MECHANICAL POLISHING SLURRY FOR POLISHING OF COPPER OR SILVER FILMS | UNIVERSITY OF FLORIDA (US) | 2003-09-04 | — | — | WO | disclosed |
| US-20030159362-A1 | Chemical-mechanical polishing slurry for polishing of copper or silver films | UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC. | 2003-08-28 | — | — | US | disclosed |
| US-6433192-B1 | Method for producing mixtures of 1,4-butanediol, tetrahydrofuran and γ-butyrolactone | BASF AKTIENGESELLSCHAFT (DE) | 2002-08-13 | — | — | US | disclosed |
| US-6426438-B1 | Method for producing 1,6-hexanediol and 6-hydroxycaproic acid or their esters | BASF AKTIENGESELLSCHAFT (DE) | 2002-07-30 | — | — | US | disclosed |
| US-6303836-B1 | Method for producing 2-cyclododecyl-1-propanol | BASF AKTIENGESELLSCHAFT (DE) | 2001-10-16 | — | — | US | disclosed |
| US-5277985-A | Alloying, fast heating annealing | CORNELL RESEARCH FOUNDATION (US) | 1994-01-11 | — | — | US | disclosed |