SCHEMBL17835477

SCHEMBL17835477

CCOc1ccc2c(c1)sc(-c1ccc(N(CC)CC)cc1)[n+]2C

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SNCA P37840 3/20 0.50
APP P05067 2/20 0.50
TNF P01375 1/20 0.50
NOD1 Q9Y239 1/20 0.50
KMT2A Q03164 3/20 0.49
BCHE P06276 3/20 0.49
MEN1 O00255 2/20 0.49
POLB P06746 2/20 0.49
NPC1 O15118 1/20 0.49
RAB9A P51151 1/20 0.49
ALDH1A1 P00352 4/20 0.43
LMNA P02545 3/20 0.43
MAPT P10636 2/20 0.43
MAPK1 P28482 1/20 0.43
L3MBTL1 Q9Y468 1/20 0.43
ACHE P22303 4/20 0.41
INSR P06213 2/20 0.37
PSMB8 P28062 1/20 0.36
PKM P14618 1/20 0.36
HSD17B10 Q99714 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL39254 0.99 SNCA (0.51) SNCAAPPTNFNOD1KMT2A
SCHEMBL19305187 0.90 SNCA (0.41) SNCAAPPTNFNOD1KMT2A
Hydrochloric Acid SCHEMBL3410018 0.89 SNCA (0.43) SNCAAPPTNFNOD1KMT2A
SCHEMBL19305186 0.89 APP (0.64) SNCAAPPTNFNOD1KMT2A
Hydrochloric Acid SCHEMBL39077 0.88 APP (0.65) SNCAAPPTNFNOD1KMT2A
SCHEMBL19305181 0.82 SNCA (0.73) SNCAAPPTNFNOD1KMT2A
Hydrochloric Acid SCHEMBL39277 0.81 SNCA (0.74) SNCAAPPTNFNOD1KMT2A
SCHEMBL19305178 0.80 MAPT (0.39) KMT2AMEN1NPC1RAB9AALDH1A1
SCHEMBL19305183 0.79 APP (0.54) SNCAAPPTNFNOD1KMT2A
Hydrochloric Acid SCHEMBL39544 0.79 ALDH1A1 (0.38) SNCAAPPKMT2ABCHEMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3034654-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-10-25 EP claimed
EP-2241653-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-06 EP claimed
EP-3034654-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2016-06-22 EP claimed