Hydrochloric Acid

Hydrochloric Acid

SCHEMBL39254

CCOc1ccc2c(c1)sc(-c1ccc(N(CC)CC)cc1)[n+]2C.[Cl-]

nearest known ligand 0.51

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACHE known ✓ P22303 2/20 0.40
SNCA P37840 3/20 0.51
APP P05067 2/20 0.51
BCHE P06276 1/20 0.51
TNF P01375 1/20 0.49
NOD1 Q9Y239 1/20 0.49
KMT2A Q03164 5/20 0.48
MEN1 O00255 4/20 0.48
POLB P06746 2/20 0.48
NPC1 O15118 2/20 0.48
RAB9A P51151 2/20 0.48
LMNA P02545 3/20 0.42
ALDH1A1 P00352 3/20 0.42
MAPT P10636 2/20 0.42
MAPK1 P28482 1/20 0.42
L3MBTL1 Q9Y468 1/20 0.42
PKM P14618 1/20 0.38
CYP19A1 P11511 1/20 0.36
CYP11B1 P15538 1/20 0.36
CYP11B2 P19099 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17835477 0.99 SNCA (0.50) SNCAAPPBCHETNFNOD1
Hydrochloric Acid SCHEMBL3410018 0.91 SNCA (0.43) SNCAAPPBCHETNFNOD1
SCHEMBL19305187 0.89 SNCA (0.41) SNCAAPPBCHETNFNOD1
Hydrochloric Acid SCHEMBL39077 0.89 APP (0.65) SNCAAPPBCHETNFNOD1
SCHEMBL19305186 0.88 APP (0.64) SNCAAPPBCHETNFNOD1
Hydrochloric Acid SCHEMBL39277 0.83 SNCA (0.74) SNCAAPPBCHETNFNOD1
SCHEMBL19305181 0.81 SNCA (0.73) SNCAAPPBCHETNFNOD1
Hydrochloric Acid SCHEMBL39544 0.80 ALDH1A1 (0.38) SNCAAPPBCHEKMT2AMEN1
Hydrochloric Acid SCHEMBL39299 0.80 APP (0.55) SNCAAPPBCHETNFNOD1
SCHEMBL19305178 0.79 MAPT (0.39) KMT2AMEN1NPC1RAB9ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3034654-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-10-25 EP claimed
US-20170275767-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-28 US claimed
EP-2241653-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-06 EP claimed
US-8758634-B2 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2014-06-24 US claimed
US-20130056438-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2013-03-07 US claimed
WO-2011147448-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2011-12-01 WO claimed
EP-2241653-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2010-10-20 EP claimed
EP-3034654-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-10-25 EP disclosed
US-20170275767-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-28 US disclosed
EP-2241653-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-06 EP disclosed
EP-3034654-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2016-06-22 EP disclosed
US-8758634-B2 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2014-06-24 US disclosed
US-20130056438-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2013-03-07 US disclosed
EP-2241653-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2010-10-20 EP disclosed