SCHEMBL18360375

SCHEMBL18360375

CC(C)(c1ccc(N(CC(=O)O)CC(=O)O)cc1)c1ccc(N(CC(=O)O)CC(=O)O)cc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MLYCD O95822 1/20 0.41
ESR1 P03372 3/20 0.40
CYP3A4 P08684 3/20 0.40
ESR2 Q92731 3/20 0.40
AR P10275 1/20 0.40
HPGD P15428 1/20 0.40
TSHR P16473 1/20 0.40
SLC6A2 P23975 1/20 0.40
SLC6A4 P31645 1/20 0.40
HTR6 P50406 1/20 0.40
ESRRG P62508 1/20 0.40
SLC6A3 Q01959 1/20 0.40
HSD17B10 Q99714 1/20 0.40
ALDH1A1 P00352 3/20 0.39
KDM4E B2RXH2 2/20 0.39
POLB P06746 1/20 0.39
NR1H4 Q96RI1 1/20 0.39
PLA2G2A P14555 1/20 0.37
BLM P54132 1/20 0.37
CYP2C19 P33261 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14463145 0.89 NR1H4 (0.49) MLYCDTSHRHSD17B10ALDH1A1NR1H4
SCHEMBL18612470 0.87 KDM4E (0.35) MLYCDESR1CYP3A4ESR2AR
SCHEMBL18719870 0.85 KDM4E (0.35) MLYCDESR1CYP3A4ESR2AR
SCHEMBL8038936 0.83 TDP1 (0.44) TSHRSLC6A2SLC6A4SLC6A3ALDH1A1
SCHEMBL18360376 0.81 KEAP1 (0.46) MLYCDKEAP1NFE2L2NPC1RAB9A
SCHEMBL9974573 0.78 KEAP1 (0.56) ALDH1A1POLBCYP2C19SMN1; SMN2KEAP1
SCHEMBL13644976 0.78 ALDH1A1 (0.50) CYP3A4HPGDTSHRHSD17B10ALDH1A1
SCHEMBL12106085 0.75 MEN1 (0.52) CYP3A4HPGDTSHRALDH1A1KDM4E
SCHEMBL13645018 0.75 CA2 (0.46) ESR1CYP3A4ESR2HPGDESRRG
SCHEMBL1932004 0.75 NR1H4 (0.55) TSHRNR1H4CYP2C19KEAP1NFE2L2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180118887-A1 PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-20180079864-A1 POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION FUJIFILM CORPORATION (JP) 2018-03-22 US disclosed
EP-3162868-A1 THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2017-05-03 EP disclosed
US-20170101521-A1 THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2017-04-13 US disclosed
WO-2017038664-A1 COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2017-03-09 WO disclosed
WO-2017002859-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, CURED FILM PRODUCTION METHOD AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2017-01-05 WO disclosed