SCHEMBL9974573

SCHEMBL9974573

Cc1ccc(N(CC(=O)O)CC(=O)O)cc1

nearest known ligand 0.56

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
KEAP1 Q14145 2/20 0.56
NFE2L2 Q16236 2/20 0.56
CYP2C19 P33261 1/20 0.48
SMN1; SMN2 Q16637 2/20 0.47
PPARG P37231 1/20 0.44
KMT2A Q03164 1/20 0.44
ALDH1A1 P00352 1/20 0.43
GAA P10253 1/20 0.42
POLB P06746 1/20 0.42
CNR2 P34972 1/20 0.42
RAB9A P51151 1/20 0.42
L3MBTL1 Q9Y468 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3349361 0.90 KEAP1 (0.51) KEAP1NFE2L2CYP2C19SMN1; SMN2KMT2A
SCHEMBL8038936 0.89 TDP1 (0.44) KEAP1NFE2L2CYP2C19SMN1; SMN2KMT2A
SCHEMBL13680117 0.88 KEAP1 (0.46) KEAP1NFE2L2CYP2C19SMN1; SMN2PPARG
SCHEMBL3348811 0.87 KEAP1 (0.49) KEAP1NFE2L2CYP2C19SMN1; SMN2PPARG
SCHEMBL3347562 0.84 KEAP1 (0.46) KEAP1NFE2L2CYP2C19SMN1; SMN2PPARG
SCHEMBL28565303 0.84 CYP2C19 (0.71) KEAP1NFE2L2CYP2C19KMT2AALDH1A1
SCHEMBL17075279 0.84 KEAP1 (0.46) KEAP1NFE2L2CYP2C19SMN1; SMN2PPARG
SCHEMBL13644976 0.83 ALDH1A1 (0.50) SMN1; SMN2KMT2AALDH1A1GAAPOLB
SCHEMBL3348892 0.81 KEAP1 (0.54) KEAP1NFE2L2SMN1; SMN2PPARGKMT2A
SCHEMBL13645018 0.80 CA2 (0.46) ALDH1A1GAAPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4188349-A Process for curing unsaturated polyesters utilizing novel initiators ICI AMERICAS INC. (US) 1980-02-12 US claimed
US-4095019-A N-SUBSTITUTED AROMATIC AMINO DIACETIC ACIDS ICI AMERICAS INC. (US) 1978-06-13 US claimed
US-20180118887-A1 PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-20180118887-A1 PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-20180079864-A1 POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION FUJIFILM CORPORATION (JP) 2018-03-22 US disclosed
US-20180079864-A1 POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION FUJIFILM CORPORATION (JP) 2018-03-22 US disclosed
EP-3162868-A1 THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2017-05-03 EP disclosed
US-20170101521-A1 THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2017-04-13 US disclosed
US-20170101521-A1 THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2017-04-13 US disclosed
WO-2017038664-A1 COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2017-03-09 WO disclosed
WO-2017002859-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, CURED FILM PRODUCTION METHOD AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2017-01-05 WO disclosed
US-8394309-B2 Resin film and method for producing it, polarizer and liquid crystal display device FUJIFILM CORPORATION (JP) 2013-03-12 US disclosed
US-8337962-B2 Resin film and method for producing it, polarizer and liquid crystal display device FUJIFILM CORPORATION (JP) 2012-12-25 US disclosed
US-20120153542-A1 RESIN FILM AND METHOD FOR PRODUCING IT, POLARIZER AND LIQUID CRYSTAL DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2012-06-21 US disclosed
US-20110273646-A1 Protective film of polarizer, polarizer and method for producing it, and liquid crystal display device FUJIFILM CORPORATION (JP) 2011-11-10 US disclosed
US-20110223435-A1 RESIN FILM AND METHOD FOR PRODUCING IT, POLARIZER AND LIQUID CRYSTAL DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2011-09-15 US disclosed
EP-2230510-A1 Electrical detection and quantification of mercury derivatives Commissariat à l'Énergie Atomique et aux Énergies Alternatives (FR) 2010-09-22 EP disclosed
US-7416835-B2 Polymerizable composition FUJIFILM CORPORATION (JP) 2008-08-26 US disclosed
US-7416835-B2 Polymerizable composition FUJIFILM CORPORATION (JP) 2008-08-26 US disclosed