SCHEMBL18400951

SCHEMBL18400951

C=C(C)C(=O)OCCC1CC2CC1CC2CC(O)(C(F)(F)F)C(F)(F)F

nearest known ligand 0.35

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
▸ THRB P10828 1/20 0.35
▸ TSHR P16473 3/20 0.34
▸ ALDH1A1 P00352 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18791205 0.93 TSHR (0.38) THRBTSHRALDH1A1
SCHEMBL14533207 0.87 ALDH1A1 (0.41) THRBTSHRALDH1A1
SCHEMBL22317681 0.87 ALDH1A1 (0.41) THRBTSHRALDH1A1
SCHEMBL18785989 0.85 THRB (0.37) THRBTSHRALDH1A1
SCHEMBL19558274 0.83 THRB (0.32) THRBTSHRALDH1A1
SCHEMBL18455465 0.82 THRB (0.33) THRBTSHRALDH1A1
SCHEMBL19335327 0.82 — —
SCHEMBL22336257 0.81 ALDH1A1 (0.40) TSHRALDH1A1
SCHEMBL23963451 0.81 TSHR (0.36) THRBTSHRALDH1A1
SCHEMBL524812 0.81 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230159766-A1 CONDUCTIVE POLYMER COMPOSITION, SUBSTRATE, AND METHOD FOR PRODUCING SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-25 — — US disclosed
US-11656548-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, mask blank with resist film, method for producing photomask, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2023-05-23 — — US disclosed
US-20200319551-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, MASK BLANK WITH RESIST FILM, METHOD FOR PRODUCING PHOTOMASK, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2020-10-08 — — US disclosed
US-20200259094-A1 CONDUCTIVE POLYMER COMPOSITE AND CONDUCTIVE POLYMER COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-08-13 — — US disclosed
US-20200247926-A1 POLYMERIZABLE MONOMER, POLYMER COMPOUND FOR CONDUCTIVE POLYMER, AND METHOD FOR PRODUCING THE POLYMER COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-08-06 — — US disclosed
US-10559397-B2 Conductive polymer composite and substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-02-11 — — US disclosed
US-10515735-B2 — — 2019-12-24 — — US disclosed
US-10240061-B2 Conductive polymer composite and substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-03-26 — — US disclosed
US-10191373-B2 Method for producing polymer SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-01-29 — — US disclosed
US-10023752-B2 Conductive material and substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-07-17 — — US disclosed
US-9958777-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-05-01 — — US disclosed
US-20180024435-A1 RESIST COMPOSITION AND PATTERNING PROCESS USING THE SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-01-25 — — US disclosed
US-9829792-B2 Monomer, polymer, positive resist composition, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-11-28 — — US disclosed
US-20170233596-A1 CONDUCTIVE POLYMER COMPOSITE AND SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-08-17 — — US disclosed
US-20170205709-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-07-20 — — US disclosed
US-20170130070-A1 CONDUCTIVE MATERIAL AND SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-11 — — US disclosed
US-20170115566-A1 RESIST COMPOSITION, PATTERNING PROCESS, AND BARIUM, CESIUM AND CERIUM SALTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-04-27 — — US disclosed
US-20170108775-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-04-20 — — US disclosed
US-20170097567-A1 METHOD FOR PRODUCING POLYMER SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-04-06 — — US disclosed
US-9551932-B2 Patterning process and resist composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-01-24 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20170115566-A1 RESIST COMPOSITION, PATTERNING PROCESS, AND BARIUM, CESIUM AND CERIUM SALTS CASR, LIFR, LBR THRB 2365/4885TSHR 508/4885ALDH1A1 4520/4885
US-20200247926-A1 POLYMERIZABLE MONOMER, POLYMER COMPOUND FOR CONDUCTIVE POLYMER, AND METHOD FOR PRODUCING THE POLYMER COMPOUND HCN4, HCN2, HCN3 THRB 3013/4885TSHR 3253/4885ALDH1A1 2526/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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