SCHEMBL18516667

SCHEMBL18516667

CC(C)(C(=O)O)C(c1ccc(Nc2ccccc2)cc1)n1ccnc1

nearest known ligand 0.81

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
▸ CYP26A1 O43174 20/20 0.81
▸ CYP1A2 P05177 1/20 0.65
▸ CYP3A4 P08684 1/20 0.65
▸ CYP2D6 P10635 1/20 0.65
▸ CYP2C9 P11712 1/20 0.65
▸ CYP2C19 P33261 1/20 0.65

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4283358 0.90 CYP26A1 (1.00) CYP26A1CYP1A2CYP3A4CYP2D6CYP2C9
SCHEMBL15550406 0.83 CYP26A1 (0.85) CYP26A1CYP1A2CYP3A4CYP2D6CYP2C9
SCHEMBL13573956 0.80 CYP26A1 (1.00) CYP26A1CYP1A2CYP3A4CYP2D6CYP2C9
SCHEMBL4289112 0.79 CYP26A1 (1.00) CYP26A1CYP1A2CYP3A4CYP2D6CYP2C9
SCHEMBL4289739 0.79 CYP26A1 (1.00) CYP26A1CYP1A2CYP3A4CYP2D6CYP2C9
SCHEMBL4280253 0.78 CYP26A1 (1.00) CYP26A1CYP1A2CYP3A4CYP2D6CYP2C9
SCHEMBL4288011 0.78 CYP26A1 (1.00) CYP26A1CYP1A2CYP3A4CYP2D6CYP2C9
SCHEMBL4284567 0.77 CYP26A1 (1.00) CYP26A1CYP1A2CYP3A4CYP2D6CYP2C9
SCHEMBL4284772 0.76 CYP26A1 (1.00) CYP26A1CYP1A2CYP3A4CYP2D6CYP2C9
SCHEMBL4283372 0.76 CYP26A1 (1.00) CYP26A1CYP1A2CYP3A4CYP2D6CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11136435-B2 Method for producing polyimide film, polyimide film, polyamic acid solution, and photosensitive composition ENEOS CORPORATION (JP) 2021-10-05 — — US disclosed
US-10954340-B2 Polyimide precursor composition TOKYO OHKA KOGYO CO., LTD. (JP) 2021-03-23 — — US disclosed
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 — — US disclosed
US-10570269-B2 Composition containing microparticles TOKYO OHKA KOGYO CO., LTD. (JP) 2020-02-25 — — US disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 — — US disclosed
EP-3514145-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD Tokyo Ohka Kogyo Co., Ltd. (JP) 2019-07-24 — — EP disclosed
EP-3228641-B1 CURABLE COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-07-03 — — EP disclosed
US-10239989-B2 Curable composition TOKYO OHKA KOGYO CO., LTD. (JP) 2019-03-26 — — US disclosed
US-20180223045-A1 POLYIMIDE PRECURSOR COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2018-08-09 — — US disclosed
WO-2018143314-A1 POLYIMIDE PRECURSOR COMPOSITION 東京応化工業株式会社 2018-08-09 — — WO disclosed
US-9981914-B2 — — 2018-05-29 — — US disclosed
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT TOKYO OHKA KOGYO CO., LTD. (JP) 2018-03-29 — — US disclosed
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT TOKYO OHKA KOGYO CO., LTD. (JP) 2018-03-29 — — US disclosed
US-20170327631-A1 CURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-11-16 — — US disclosed
US-20170327631-A1 CURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-11-16 — — US disclosed
EP-3228641-A1 CURABLE COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2017-10-11 — — EP disclosed
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2017-08-31 — — US disclosed
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2017-08-31 — — US disclosed
EP-3184511-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD Tokyo Ohka Kogyo Co., Ltd. (JP) 2017-06-28 — — EP disclosed
WO-2017026448-A1 POLYIMIDE PRECURSOR COMPOSITION 東京応化工業株式会社 2017-02-16 — — WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT SLC9A2, SLC9A1, NHERF1 CYP26A1 2088/4885CYP1A2 1710/4885CYP3A4 2459/4885
US-20170247334-A1 IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD FASN, SLC27A1, SLC27A2 CYP26A1 988/4885CYP1A2 662/4885CYP3A4 354/4885
US-10570269-B2 Composition containing microparticles CHMP4B, EXOSC10, EXOSC9 CYP26A1 3761/4885CYP1A2 2944/4885CYP3A4 2341/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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