SCHEMBL18675604

SCHEMBL18675604

CC1C2CC(C(=O)OCCCC(=O)OC3(C)CCCCC3)C(C2)C1C

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18878486 0.86 CYP19A1 (0.35) CYP19A1
SCHEMBL18675601 0.84 CYP19A1 (0.33) CYP19A1
SCHEMBL2680946 0.81 SCN1A (0.40) CYP19A1
SCHEMBL2681886 0.80 SCN1A (0.41) CYP19A1
SCHEMBL18675585 0.78
SCHEMBL13319477 0.75
SCHEMBL2680868 0.75 ALDH1A1 (0.39)
SCHEMBL18675589 0.74 SCN1A (0.43)
SCHEMBL2680861 0.73 NAAA (0.39)
SCHEMBL13319480 0.73 ACHE (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180002561-A1 RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, IMPRINT FORMING KIT, LAMINATE, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING DEVICE FUJIFILM CORPORATION (JP) 2018-01-04 US disclosed
US-20170158905-A1 RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, LAYERED PRODUCT, METHOD FOR FORMING PATTERN, IMPRINT FORMING KIT, AND PROCESS FOR PRODUCING DEVICE FUJIFILM CORPORATION (JP) 2017-06-08 US disclosed
US-20170146907-A1 RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, LAYERED PRODUCT, METHOD FOR FORMING PATTERN, IMPRINT FORMING KIT AND PROCESS FOR PRODUCING DEVICE FUJIFILM CORPORATION (JP) 2017-05-25 US disclosed
US-20170088743-A1 RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, LAYERED PRODUCT, METHOD FOR FORMING PATTERN, AND PROCESS FOR PRODUCING DEVICE FUJIFILM CORPORATION (JP) 2017-03-30 US disclosed