SCHEMBL188018

SCHEMBL188018

CCCOC([SiH3])OCCC

nearest known ligand 0.32

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 1/20 0.32
TDP1 Q9NUW8 1/20 0.31
THRB P10828 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL187633 0.81 ADRB2 (0.41) THRB
SCHEMBL31509585 0.79 DNM1 (0.48) THRB
SCHEMBL54730 0.72 THRB (0.50) HSD17B10TDP1THRB
SCHEMBL59849 0.72
SCHEMBL5270484 0.72 HSD17B10 (0.35) HSD17B10TDP1THRB
Methane SCHEMBL25432464 0.69
SCHEMBL531227 0.69 LMNA (0.53) HSD17B10TDP1THRB
SCHEMBL22296938 0.69 HSD17B10 (0.39) HSD17B10TDP1THRB
SCHEMBL43573 0.69
SCHEMBL17174023 0.69 HSD17B10 (0.39) HSD17B10TDP1THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118373844-A H-type heat conduction powder treating agent, light heat conduction pouring sealant and preparation method thereof 唐山三友硅业股份有限公司 2024-07-23 CN disclosed
CN-112724405-B Curing agent mixture 赢创运营有限公司 2024-01-30 CN disclosed
CN-117321141-A Solvent-free composition 日产化学株式会社 2023-12-29 CN disclosed
CN-117279999-A Composition for forming film 日产化学株式会社 2023-12-22 CN disclosed
CN-113646376-B Charge-transporting varnish 日产化学株式会社 2023-09-26 CN disclosed
CN-115678542-A Quaternary nanostructure based on bright silver 纳米系统公司 2023-02-03 CN disclosed
CN-113840895-B Quaternary nanostructure based on bright silver 纳米系统公司 2022-11-15 CN disclosed
WO-2022225012-A1 FILM-FORMING COMPOSITION 日産化学株式会社 2022-10-27 WO disclosed
WO-2022225003-A1 FILM-FORMING COMPOSITION 日産化学株式会社 2022-10-27 WO disclosed
WO-2022225017-A1 SOLVENTLESS COMPOSITION 日産化学株式会社 2022-10-27 WO disclosed
EP-1051461-A2 FUEL COMPOSITIONS EMPLOYING CATALYST COMBUSTION STRUCTURE ORR, William C. (US) 2000-11-15 EP disclosed
WO-1999066009-A2 FUEL COMPOSITIONS EMPLOYING CATALYST COMBUSTION STRUCTURE ORR WILLIAM C (US) 1999-12-23 WO disclosed
EP-0954558-A1 FUEL COMPOSITIONS EXHIBITING IMPROVED FUEL STABILITY ORR, William C. (US) 1999-11-10 EP disclosed
WO-1998026028-A1 FUEL COMPOSITIONS EXHIBITING IMPROVED FUEL STABILITY ORR WILLIAM C (US) 1998-06-18 WO disclosed
US-4210588-A ADHESION PROMOTERS BETWEEN INORGANIC SOLIDS AND ORGANIC RESINS CIBA-GEIGY CORPORATION (US) 1980-07-01 US disclosed
US-4210588-A ADHESION PROMOTERS BETWEEN INORGANIC SOLIDS AND ORGANIC RESINS CIBA-GEIGY CORPORATION (US) 1980-07-01 US disclosed
US-4193927-A USED IN MANUFACTURE OF POLYMERS WHICH CAN BE CROSSLINKED BY LIGHT CIBA-GEIGY CORPORATION (US) 1980-03-18 US disclosed
US-4174326-A Imidyl compounds CIBA-GEIGY CORPORATION (US) 1979-11-13 US disclosed
US-4172836-A Imidyl compounds CIBA-GEIGY CORPORATION (US) 1979-10-30 US disclosed
US-4107174-A POLYMER MONOMERS CIBA-GEIGY CORPORATION (US) 1978-08-15 US disclosed