SCHEMBL21753858

SCHEMBL21753858

C[PH](=O)[O-].C[PH](=O)[O-].[Ca+2]

nearest known ligand 0.00

Known targets — ChEMBL curated mechanism

GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHMGCRMMP1MMP13MMP7MMP8PTGS1PTGS2ileSpolrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methane SCHEMBL190073 0.95
SCHEMBL28992401 0.89
Potassium Ion SCHEMBL8020727 0.89
SCHEMBL27040314 0.89
SCHEMBL331580 0.89
SCHEMBL31331559 0.89
SCHEMBL31331590 0.89
Zinc Ion SCHEMBL17537077 0.89
SCHEMBL31331630 0.89
Methane SCHEMBL345547 0.84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116875046-A Red phosphorus flame-retardant non-reinforced nylon/polyphenyl ether alloy material and preparation method thereof 北京市化学工业研究院有限责任公司 2023-10-13 CN claimed
EP-4663703-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE Mitsui Chemicals, Inc. (JP) 2025-12-17 EP disclosed
CN-119604596-A Adhesive composition, and adhesive sheet, laminate and printed wiring board containing same 东洋纺艾睦希株式会社 2025-03-11 CN disclosed
CN-118163453-A Decorative sheet and decorative plate 大日本印刷株式会社 2024-06-11 CN disclosed
CN-118139935-A Resin composition, pellet and molded article 三菱化学株式会社 2024-06-04 CN disclosed
CN-114133560-B Process for the preparation of semiaromatic polyamides with improved impact strength, semiaromatic polyamides and moulding compositions 山东广垠新材料有限公司 2024-03-08 CN disclosed
CN-117529527-A Halogen-free, fire-resistant, compatible polyamide and polyphenylene ether mixtures 特诺尔艾佩斯公司 2024-02-06 CN disclosed
CN-117440884-A Molded article, welding method, and method for producing molded article 旭化成株式会社 2024-01-23 CN disclosed
CN-115052929-B Thermoplastic resin composition, method for preparing the same, and molded article manufactured using the same 株式会社LG化学 2024-01-12 CN disclosed
CN-114058009-B Process for the preparation of semi-aromatic polyamides with reduced diamine monomer loss, semi-aromatic polyamides and molding compositions 山东广垠新材料有限公司 2023-11-10 CN disclosed
CN-112080125-B Protective case member for mobile battery pack 旭化成株式会社 2023-05-23 CN disclosed
CN-111406086-B Vehicle-mounted lithium ion battery component 旭化成株式会社 2023-04-28 CN disclosed
WO-2022191310-A1 MOLDED ARTICLE, PRODUCTION METHOD FOR LASER-MARKED MOLDED ARTICLE, AND LASER MARKING METHOD 旭化成株式会社 2022-09-15 WO disclosed
CN-114133560-A Process for preparing semiaromatic polyamides with improved impact strength, semiaromatic polyamides and moulding compositions 山东广垠新材料有限公司 2022-03-04 CN disclosed
CN-114133559-A Process for preparing semiaromatic polyamides with reduced salt formation cycle, semiaromatic polyamides and moulding compositions 山东广垠新材料有限公司 2022-03-04 CN disclosed
CN-114058010-A Process for preparing low-energy semiaromatic polyamides, semiaromatic polyamides and moulding compositions 山东广垠新材料有限公司 2022-02-18 CN disclosed
CN-114058009-A Process for preparing semi-aromatic polyamides with reduced loss of diamine monomer, semi-aromatic polyamides and molding compositions 山东广垠新材料有限公司 2022-02-18 CN disclosed
CN-114058008-A Process for preparing semi-aromatic polyamides end-capped with monocarboxylic acids, semi-aromatic polyamides and molding compositions 山东广垠新材料有限公司 2022-02-18 CN disclosed
CN-110903644-A Bio-based PA56T and PA56 composite material and preparation method thereof 广东泰塑新材料科技有限公司 2020-03-24 CN disclosed
WO-2020040282-A1 POLYAMIDE AND POLYAMIDE COMPOSITION 株式会社クラレ 2020-02-27 WO disclosed