SCHEMBL1901065

SCHEMBL1901065

C=COC(=O)c1ccccc1-c1ccccc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BCAT2 O15382 1/20 0.52
MEN1 O00255 1/20 0.47
KMT2A Q03164 1/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
SCN1A P35498 5/20 0.47
SCN2A Q99250 5/20 0.47
SCN3A Q9NY46 5/20 0.47
SLC6A3 Q01959 3/20 0.46
SLC6A4 P31645 2/20 0.46
CHRNB2 P17787 2/20 0.46
CHRNB4 P30926 2/20 0.46
CHRNA3 P32297 2/20 0.46
CHRNA4 P43681 2/20 0.46
HNF4A P41235 1/20 0.44
TSHR P16473 1/20 0.44
RECQL P46063 1/20 0.44
ADORA3 P0DMS8 1/20 0.43
GPR52 Q9Y2T5 1/20 0.42
FABP3 P05413 1/20 0.41
FABP4 P15090 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19506917 0.89 CYP3A4 (0.46) BCAT2SLC6A3SLC6A4TSHR
SCHEMBL27918640 0.87 HNF4A (0.44) BCAT2MEN1KMT2ASMN1; SMN2SCN1A
SCHEMBL6157817 0.84 BCAT2 (0.53) BCAT2MEN1KMT2ASMN1; SMN2SCN1A
SCHEMBL15175 0.82 CYP3A4 (0.55) TSHR
SCHEMBL9312664 0.81 SLC6A3 (0.67) MEN1KMT2ASMN1; SMN2SLC6A3SLC6A4
Ethylene SCHEMBL29113890 0.81 CYP3A4 (0.53) TSHR
SCHEMBL31521259 0.79 BCAT2 (0.57) BCAT2MEN1KMT2ASMN1; SMN2SCN1A
SCHEMBL5180034 0.79 BCAT2 (0.57) BCAT2MEN1KMT2ASMN1; SMN2SCN1A
Acetic Acid SCHEMBL27451410 0.79 CYP3A4 (0.48) TSHR
SCHEMBL220576 0.79 ALDH1A1 (0.56) KMT2ASMN1; SMN2TSHRPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20110101503-A1 HYPERBRANCHED POLYMER SYNTHESIZING METHOD, HYPERBRANCHED POLYMER, RESIST COMPOSITION, SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION METHOD LION CORPORATION (JP) 2011-05-05 US disclosed
US-20030096172-A1 Hologram recording material composition and hologram recording medium DAISO CO., LTD. (JP) 2003-05-22 US disclosed
EP-0980025-A1 Hologram recording material composition, hologram recording medium, and process for producing the same. AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 2000-02-16 EP disclosed