Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.54 |
| ▸ | TRPA1 | O75762 | 2/20 | 0.48 |
| ▸ | GABRA1 | P14867 | 3/20 | 0.43 |
| ▸ | GABRB2 | P47870 | 3/20 | 0.43 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.41 |
| ▸ | HPGD | P15428 | 1/20 | 0.41 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.41 |
| ▸ | CA12 | O43570 | 2/20 | 0.41 |
| ▸ | CA1 | P00915 | 2/20 | 0.41 |
| ▸ | CA2 | P00918 | 2/20 | 0.41 |
| ▸ | CA9 | Q16790 | 2/20 | 0.41 |
| ▸ | IAPP | P10997 | 3/20 | 0.40 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.39 |
| ▸ | PTGER1 | P34995 | 1/20 | 0.39 |
| ▸ | PTGER4 | P35408 | 1/20 | 0.39 |
| ▸ | PTGER3 | P43115 | 1/20 | 0.39 |
| ▸ | PTGER2 | P43116 | 1/20 | 0.39 |
| ▸ | ATM | Q13315 | 1/20 | 0.38 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.37 |
| ▸ | PKM | P14618 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8405872 | 0.88 | ALDH1A1 (0.50) | ALDH1A1TRPA1GABRA1GABRB2KDM4E | |
| SCHEMBL8997129 | 0.86 | ALDH1A1 (0.48) | ALDH1A1TRPA1GABRA1GABRB2KDM4E | |
| SCHEMBL11109102 | 0.84 | GABRA1 (0.52) | ALDH1A1GABRA1GABRB2KDM4EHPGD | |
| SCHEMBL8400520 | 0.83 | ALDH1A1 (0.54) | ALDH1A1TRPA1GABRA1GABRB2KDM4E | |
| SCHEMBL1005722 | 0.83 | ALDH1A1 (0.54) | ALDH1A1TRPA1GABRA1GABRB2KDM4E | |
| SCHEMBL1901144 | 0.82 | ALDH1A1 (0.59) | ALDH1A1TRPA1GABRA1GABRB2KDM4E | |
| SCHEMBL9513545 | 0.81 | ALDH1A1 (0.52) | ALDH1A1TRPA1GABRA1GABRB2KDM4E | |
| SCHEMBL8902160 | 0.81 | ALDH1A1 (0.52) | ALDH1A1TRPA1GABRA1GABRB2KDM4E | |
| SCHEMBL11785077 | 0.81 | ALDH1A1 (0.52) | ALDH1A1TRPA1GABRA1GABRB2KDM4E | |
| SCHEMBL629761 | 0.80 | ESR1 (0.46) | ALDH1A1TRPA1GABRA1GABRB2HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122095031-A | Resin composition, dry film, cured product, and light-emitting element mounting substrate | — | 2026-05-26 | — | — | CN | disclosed |
| WO-2025095045-A1 | TRANSPARENT RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT | 太陽ホールディングス株式会社 | 2025-05-08 | — | — | WO | disclosed |
| WO-2025095046-A1 | RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND LIGHT EMITTING ELEMENT MOUNTED SUBSTRATE | 太陽ホールディングス株式会社 | 2025-05-08 | — | — | WO | disclosed |
| CN-119278225-A | Curable resin, curable resin intermediate, curable resin composition, and method for producing cured product | 株式会社日本触媒 | 2025-01-07 | — | — | CN | disclosed |
| CN-113168097-B | Positive dry film resist and etching method | 三菱制纸株式会社 | 2024-08-23 | — | — | CN | disclosed |
| WO-2024009612-A1 | CURABLE RESIN, AND METHODS FOR MANUFACTURING CURABLE RESIN INTERMEDIATE, CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT | 株式会社日本触媒 | 2024-01-11 | — | — | WO | disclosed |
| US-20230324789-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PERMANENT RESIST, METHOD FOR FORMING PERMANENT RESIST, AND METHOD FOR INSPECTING PERMANENT RESIST CURED FILM | RESONAC CORPORATION (JP) | 2023-10-12 | — | — | US | disclosed |
| WO-2023281584-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PERMANENT RESIST, METHOD FOR FORMING PERMANENT RESIST, AND METHOD FOR INSPECTING PERMANENT RESIST CURED FILM | 昭和電工マテリアルズ株式会社 | 2023-01-12 | — | — | WO | disclosed |
| CN-113168097-A | Positive dry film resist and etching method | 三菱制纸株式会社 | 2021-07-23 | — | — | CN | disclosed |
| WO-2020065860-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN CURED FILM AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE | 日立化成株式会社 | 2020-04-02 | — | — | WO | disclosed |
| US-20090214979-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-08-27 | — | — | US | disclosed |
| US-20090111048-A1 | ALKALI-DEVELOPABLE BLACK PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING LIGHT-SHIELDING BARRIER WALL | TAIYO INK MFG.CO., LTD. (JP) | 2009-04-30 | — | — | US | disclosed |
| US-6773855-B1 | PRINTED CIRCUIT BOARD HAVING A SOLDER RESIST FILM FORMED FROM THE CURED FILM | TAIYO INK MANUFACTURING CO., LTD. (JP) | 2004-08-10 | — | — | US | disclosed |
| US-6749765-B2 | Aperture fill | SHIPLEY COMPANY, L.L.C. | 2004-06-15 | — | — | US | disclosed |
| US-6461717-B1 | Aperture fill | SHIPLEY COMPANY, L.L.C. | 2002-10-08 | — | — | US | disclosed |
| US-20020110665-A1 | Aperture fill | SHIPLEY COMPANY, L.L.C. | 2002-08-15 | — | — | US | disclosed |
| EP-1172695-A1 | Barrier layer | Shipley Company LLC (US) | 2002-01-16 | — | — | EP | disclosed |
| EP-1150343-A2 | Aperture fill | Shipley Company LLC (US) | 2001-10-31 | — | — | EP | disclosed |
| US-6077879-A | RADICALLY POLYMERIZABLE CURABLE RESIN OBTAINED BY REACTING POLYEPOXIDE WITH PHENOL COMPOUND HAVING ALCOHOLIC HYDROXYL GROUP AND UNSATURATED MONOBASIC ACID | NIPPON SHOKUBAI CO., LTD. (JP) | 2000-06-20 | — | — | US | disclosed |
| EP-0517017-A2 | Thermoplastic resin composition | MITSUBISHI CHEMICAL CORPORATION (JP) | 1992-12-09 | — | — | EP | disclosed |