SCHEMBL19986269

SCHEMBL19986269

CC(N)(c1ccc(O)c(NC(=O)c2ccc(N)cc2)c1)c1ccc(O)c(NC(=O)c2ccc(N)cc2)c1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 5/20 0.59
KCNMA1 Q12791 4/20 0.49
MEN1 O00255 3/20 0.46
KMT2A Q03164 3/20 0.46
LMNA P02545 1/20 0.46
POLB P06746 1/20 0.46
PKM P14618 1/20 0.46
APEX1 P27695 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
PTGS1 P23219 2/20 0.46
MAPT P10636 4/20 0.45
GAA P10253 2/20 0.45
MAPK1 P28482 1/20 0.45
HDAC2 Q92769 1/20 0.44
CA1 P00915 1/20 0.44
CA2 P00918 1/20 0.44
CYP1A2 P05177 1/20 0.43
CYP2C9 P11712 1/20 0.43
CYP2C19 P33261 1/20 0.43
AKT1 P31749 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13601071 0.90 HDAC1 (0.60) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL19600606 0.85 HDAC1 (0.55) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL18360223 0.84 HDAC1 (0.57) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL2605585 0.83 HDAC1 (0.70) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL10069697 0.82 HDAC1 (0.58) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL6030714 0.82 KCNMA1 (0.56) HDAC1KCNMA1MEN1KMT2ATDP1
SCHEMBL29999394 0.81 MEN1 (0.56) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL28918150 0.81 MEN1 (0.56) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL13601069 0.80 HDAC1 (0.67) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL13601067 0.80 HDAC1 (0.86) HDAC1KCNMA1MEN1KMT2ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180079864-A1 POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION FUJIFILM CORPORATION (JP) 2018-03-22 US disclosed
US-20180079864-A1 POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION FUJIFILM CORPORATION (JP) 2018-03-22 US disclosed