SCHEMBL196249

SCHEMBL196249

CC(C)OCN1C(=O)N(COC(C)C)C2C1N(COC(C)C)C(=O)N2COC(C)C

nearest known ligand 0.39

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 1/20 0.39
ADRA2C P18825 1/20 0.35
GAA P10253 2/20 0.33
TP53 P04637 1/20 0.33
TSHR P16473 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18804145 0.82 L3MBTL1 (0.33) L3MBTL1
SCHEMBL20438430 0.81
SCHEMBL18804150 0.78 L3MBTL1 (0.33) L3MBTL1
SCHEMBL26309047 0.74 L3MBTL1 (0.38) L3MBTL1GAATP53TSHR
SCHEMBL18804153 0.71 L3MBTL1 (0.39) L3MBTL1
SCHEMBL12316951 0.70 GAA (0.48) L3MBTL1ADRA2CGAATP53TSHR
SCHEMBL26309032 0.69 L3MBTL1 (0.34) L3MBTL1TSHR
SCHEMBL196251 0.68 L3MBTL1 (0.39) L3MBTL1GAA
SCHEMBL18804151 0.67 L3MBTL1 (0.32) L3MBTL1
SCHEMBL12748112 0.67 L3MBTL1 (0.57) L3MBTL1GAATP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 145 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7008476-B2 Modified alginic acid of alginic acid derivatives and thermosetting anti-reflective compositions thereof AZ ELECTRONIC MATERIALS USA CORP. (US) 2006-03-07 US claimed
US-20040253532-A1 Modified alginic acid of alginic acid derivatives and thermosetting anti-reflective compositions thereof MERCK PATENT GMBH (DE) 2004-12-16 US claimed
US-11822248-B2 Coating compositions for use with an overcoated photoresist ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2023-11-21 US disclosed
US-11822248-B2 Coating compositions for use with an overcoated photoresist ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2023-11-21 US disclosed
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-02-07 US disclosed
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-02-08 US disclosed
US-20200409261-A1 COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING AMORPHOUS FILM, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2020-12-31 US disclosed
US-10816898-B2 2020-10-27 US disclosed
US-10788751-B2 Coating composition for use with an overcoated photoresist ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2020-09-29 US disclosed
EP-2080750-B1 RADIATION-SENSITIVE COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2020-07-29 EP disclosed
US-10444627-B2 Pattern formation method, active light-sensitive or radiation-sensitive resin composition, resist film, production method for electronic device using same, and electronic device FUJIFILM CORPORATION (JP) 2019-10-15 US disclosed
US-7008476-B2 Modified alginic acid of alginic acid derivatives and thermosetting anti-reflective compositions thereof AZ ELECTRONIC MATERIALS USA CORP. (US) 2006-03-07 US disclosed
WO-2005052016-A2 BOTTOM ANTIREFLECTIVE COATINGS AZ ELECTRONIC MATERIALS USA CORP. (DE) 2005-06-09 WO disclosed
US-20050112494-A1 Bottom antireflective coatings AZ ELECTRONIC MATERIALS USA CORP. 2005-05-26 US disclosed
WO-2004111092-A1 MODIFIED ALGINIC ACID OR ALGINIC ACID DERIVATIVES AND THERMOSETTING ANTI-REFLECTIVE COMPOSITIONS THEREOF AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-12-23 WO disclosed
US-20040253532-A1 Modified alginic acid of alginic acid derivatives and thermosetting anti-reflective compositions thereof MERCK PATENT GMBH (DE) 2004-12-16 US disclosed
US-20030022095-A1 Negative type radiation sensitive resin composition JSR CORPORATION (JP) 2003-01-30 US disclosed
US-6468714-B2 FINE PHOTORESIST PATTERNS JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010006758-A1 Negative radiation-sensitive resin composition JSR CORPORATION (JP) 2001-07-05 US disclosed
EP-1111465-A1 Negative radiation-sensitive resin composition JSR Corporation (JP) 2001-06-27 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20200409261-A1 COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING AMORPHOUS FILM, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD C9, C1R, RAD51 L3MBTL1 345/4885ADRA2C 2751/4885GAA 4720/4885
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R L3MBTL1 293/4885ADRA2C 2618/4885GAA 4768/4885
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R L3MBTL1 293/4885ADRA2C 2618/4885GAA 4768/4885
US-10816898-B2 C5, C9, H1-0 L3MBTL1 770/4885ADRA2C 1896/4885GAA 4420/4885
US-10788751-B2 Coating composition for use with an overcoated photoresist COL14A1, COPE, COL2A1 L3MBTL1 4233/4885ADRA2C 3089/4885GAA 3774/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.