SCHEMBL19713141

SCHEMBL19713141

Cc1ccc([Ti](OC(C)C)(OC(C)C)OC(C)C)cc1

nearest known ligand 0.38

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
ACHE P22303 5/20 0.38
TDP1 Q9NUW8 1/20 0.38
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
CA7 P43166 1/20 0.31
CA9 Q16790 1/20 0.31
ALDH1A1 P00352 1/20 0.31
CHRNA7 P36544 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3609530 0.78 ALDH1A1 (0.35) TDP1ALDH1A1
SCHEMBL19713183 0.72 ACHE (0.44) ACHETDP1CA1CA2CA7
SCHEMBL7597740 0.64 ACHE (0.57) ACHETDP1CA1CA2CA7
Toluene SCHEMBL9167439 0.64 ACHE (0.48) ACHEALDH1A1
Toluene SCHEMBL3917267 0.64 LMNA (0.48) ACHETDP1ALDH1A1
P-Xylene SCHEMBL460348 0.62 ACHE (1.00) ACHETDP1CA1CA2CA7
P-Xylene SCHEMBL28550622 0.62 ACHE (0.44) ACHETDP1CA1CA2CA7
P-Xylene SCHEMBL771 0.62
SCHEMBL104201 0.62 ALDH1A3 (0.54) ACHETDP1ALDH1A1
P-Xylene SCHEMBL11770184 0.62 ACHE (1.00) ACHETDP1CA1CA2CA7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180264783-A1 Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board JX NIPPON MINING & METALS CORPORATION (JP) 2018-09-20 US disclosed
US-20170362733-A1 COPPER FOIL WITH RELEASE LAYER, LAMINATED MATERIAL, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC APPARATUS JX NIPPON MINING & METALS CORPORATION (JP) 2017-12-21 US disclosed