⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18726905 | 0.90 | CA2 (0.39) | — | |
| Trifluoromethanesulfonic Acid SCHEMBL9013056 | 0.83 | GSTO1 (0.34) | — | |
| SCHEMBL15355094 | 0.83 | NOTUM (0.32) | — | |
| SCHEMBL3789232 | 0.74 | TRPV4 (0.42) | — | |
| SCHEMBL3824427 | 0.74 | KIF11 (0.43) | — | |
| SCHEMBL13449768 | 0.74 | KCNH2 (0.32) | — | |
| SCHEMBL12012110 | 0.73 | ALDH1A1 (0.41) | — | |
| SCHEMBL15915347 | 0.73 | — | — | |
| SCHEMBL30427758 | 0.71 | CNR1 (0.33) | — | |
| SCHEMBL28872281 | 0.71 | CNR1 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119998727-A | Chemically amplified positive resist composition for improving pattern profile and enhancing etch resistance | YC化学制品株式会社 | 2025-05-13 | — | — | CN | claimed |
| EP-2657766-B1 | Patterning process | SHINETSU CHEMICAL CO (JP) | 2018-02-28 | — | — | EP | disclosed |
| CN-106444288-A | Chemically amplified positive resist composition and pattern forming process | 信越化学工业株式会社 | 2017-02-22 | — | — | CN | disclosed |
| CN-106019841-A | Photosensitive resin composition, pattern forming method, cured film, insulation film, color filter and display device | 东京应化工业株式会社 | 2016-10-12 | — | — | CN | disclosed |
| CN-103781813-B | The epoxy resin adduct mixed | 蓝立方知识产权有限责任公司 | 2016-09-14 | — | — | CN | disclosed |
| CN-105676601-A | Pretreatment method of glass substrate used for forming etching mask | 东京应化工业株式会社 | 2016-06-15 | — | — | CN | disclosed |
| CN-103228694-B | Heat curable composition and the thermosetting material prepared by heat curable composition | Blue Cube Intellectual Property Co.,Ltd. (US) | 2016-04-27 | — | — | CN | disclosed |
| CN-105301905-A | Chemically amplified positive resist composition and patterning process | SHINETSU CHEMICAL CO | 2016-02-03 | — | — | CN | disclosed |
| CN-105283432-A | Composition comprising a compound containing a vinyl group | TOKYO OHKA KOGYO CO LTD | 2016-01-27 | — | — | CN | disclosed |
| CN-103124757-B | Advanced composition epoxy resin | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-11-25 | — | — | CN | disclosed |
| CN-104909581-A | Pretreatment method of glass substrate used for forming etching mask | TOKYO OHKA KOGYO COMPANY | 2015-09-16 | — | — | CN | disclosed |
| CN-104649580-A | Chemical tempered glass substrate processing method | TOKYO OHKA KOGYO COMPANY | 2015-05-27 | — | — | CN | disclosed |
| CN-103857721-A | Hybrid epoxy resins | DOW GLOBAL TECHNOLOGIES INC | 2014-06-11 | — | — | CN | disclosed |
| CN-103781813-A | Hybrid epoxy resin adducts | DOW GLOBAL TECHNOLOGIES INC | 2014-05-07 | — | — | CN | disclosed |
| CN-103176353-A | Chemically amplified negative resist composition and patterning process | SHINETSU CHEMICAL CO | 2013-06-26 | — | — | CN | disclosed |
| CN-103140533-A | Epoxy resin compositions | DOW GLOBAL TECHNOLOGIES LLC | 2013-06-05 | — | — | CN | disclosed |