SCHEMBL19971915

SCHEMBL19971915

Cc1ccccc1CSCc1ccc(OS(C)(=O)=O)cc1

nearest known ligand 0.49

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
MAPT P10636 5/20 0.47
LMNA P02545 4/20 0.47
KDM4E B2RXH2 1/20 0.47
ALDH1A1 P00352 8/20 0.44
GLA P06280 1/20 0.44
L3MBTL1 Q9Y468 2/20 0.42
CYP1A2 P05177 1/20 0.40
CYP3A4 P08684 1/20 0.40
CYP2D6 P10635 1/20 0.40
CYP2C9 P11712 1/20 0.40
CYP2C19 P33261 1/20 0.40
TSHR P16473 1/20 0.39
GAA P10253 2/20 0.38
MEN1 O00255 1/20 0.38
THRB P10828 1/20 0.38
KMT2A Q03164 1/20 0.38
HPGD P15428 2/20 0.37
HTT P42858 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19971914 0.85 LMNA (0.47) MAPTLMNAKDM4EALDH1A1GLA
SCHEMBL28687523 0.78 LMNA (0.51) MAPTLMNAKDM4EALDH1A1GLA
SCHEMBL29634752 0.78 MAPT (0.51) MAPTLMNAKDM4EALDH1A1GLA
SCHEMBL28682455 0.76 LMNA (0.56) MAPTLMNAKDM4EALDH1A1L3MBTL1
SCHEMBL28697234 0.75 ALDH1A1 (0.54) MAPTLMNAKDM4EALDH1A1GLA
SCHEMBL756535 0.74 MAPT (0.53) MAPTLMNAKDM4EALDH1A1GLA
SCHEMBL777337 0.74 ALDH1A1 (0.56) MAPTLMNAALDH1A1L3MBTL1CYP1A2
SCHEMBL758838 0.73 LMNA (0.51) MAPTLMNAKDM4EALDH1A1GLA
SCHEMBL759546 0.72 LMNA (0.60) MAPTLMNAKDM4EALDH1A1GLA
Trifluoromethanesulfonic Acid SCHEMBL29479975 0.71 LMNA (0.44) MAPTLMNAKDM4EALDH1A1GLA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4063953-A1 PATTERN FORMING METHOD, PHOTOCURABLE RESIN COMPOSITION, LAYERED BODY MANUFACTURING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD FUJIFILM Corporation (JP) 2022-09-28 EP disclosed
US-20180118887-A1 PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-20180079864-A1 POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION FUJIFILM CORPORATION (JP) 2018-03-22 US disclosed