Known targets — ChEMBL curated mechanism
ABL1ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB2AGTR1BCL2BCL2A1BCL2L1BCL2L10BCL2L2BCRBRAFCHRM1CHRNA10CHRNA9DRD1DRD2DRD3DRD4DRD5EGFRF2FLT1FLT4GCKGHSRGNRHRGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHTR1AHTR1BHTR1DHTR2AHTR2CHTR3AIDH2KDRKITMAOBMCL1MTTPPP4HBPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PIKFYVEROCK1ROCK2SLC18A2SLC6A2SLC6A3SLC6A4TACR1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8gyrAgyrBparCparEpol
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 5/20 | 0.51 |
| ▸ | LMNA | P02545 | 5/20 | 0.51 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.51 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.46 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.46 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.46 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.46 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.46 |
| ▸ | HPGD | P15428 | 2/20 | 0.44 |
| ▸ | HTT | P42858 | 2/20 | 0.43 |
| ▸ | GLA | P06280 | 1/20 | 0.43 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.42 |
| ▸ | TSHR | P16473 | 1/20 | 0.42 |
| ▸ | MEN1 | O00255 | 1/20 | 0.42 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.42 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.40 |
| ▸ | DAO | P14920 | 1/20 | 0.40 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL758838 | 0.91 | LMNA (0.51) | MAPTLMNAKDM4EALDH1A1CYP1A2 | |
| SCHEMBL31038959 | 0.89 | LMNA (0.47) | MAPTLMNAKDM4EALDH1A1CYP1A2 | |
| Trifluoromethanesulfonic Acid SCHEMBL29479975 | 0.89 | LMNA (0.44) | MAPTLMNAKDM4EALDH1A1CYP1A2 | |
| SCHEMBL28023928 | 0.85 | LMNA (0.47) | MAPTLMNAKDM4EALDH1A1CYP1A2 | |
| SCHEMBL20291443 | 0.84 | IDO1 (0.49) | MAPTLMNAKDM4EALDH1A1CYP3A4 | |
| SCHEMBL19971915 | 0.78 | MAPT (0.47) | MAPTLMNAKDM4EALDH1A1CYP1A2 | |
| SCHEMBL28473257 | 0.78 | KEAP1 (0.47) | MAPTLMNAKDM4EALDH1A1CYP1A2 | |
| SCHEMBL28682455 | 0.77 | LMNA (0.56) | MAPTLMNAKDM4EALDH1A1CYP1A2 | |
| SCHEMBL29640378 | 0.76 | GAA (0.45) | MAPTLMNAKDM4EALDH1A1HPGD | |
| SCHEMBL759546 | 0.76 | LMNA (0.60) | MAPTLMNAKDM4EALDH1A1CYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114730132-B | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2025-05-09 | — | — | CN | disclosed |
| CN-114761466-B | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2024-12-10 | — | — | CN | disclosed |
| CN-114008527-B | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and polyimide or polyimide precursor | 富士胶片株式会社 | 2024-11-01 | — | — | CN | disclosed |
| CN-116113884-A | Method for producing cured product, method for producing laminate, and method for producing electronic device | 富士胶片株式会社 | 2023-05-12 | — | — | CN | disclosed |
| CN-115867866-A | Method for producing cured product, resin composition, developer, method for producing laminate, and method for producing semiconductor device | 富士胶片株式会社 | 2023-03-28 | — | — | CN | disclosed |
| CN-115768832-A | Resin composition, method for producing same, and method for producing composition for pattern formation | 富士胶片株式会社 | 2023-03-07 | — | — | CN | disclosed |
| CN-115190891-A | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-10-14 | — | — | CN | disclosed |
| CN-115038755-A | Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-09-09 | — | — | CN | disclosed |
| CN-114761466-A | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2022-07-15 | — | — | CN | disclosed |
| CN-114730132-A | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2022-07-08 | — | — | CN | disclosed |
| CN-108700836-B | Method for manufacturing laminate and method for manufacturing semiconductor device | 富士胶片株式会社 | 2022-06-28 | — | — | CN | disclosed |