SCHEMBL20115310

SCHEMBL20115310

C=C(C)C(=O)OCCOC(=O)c1cc(Oc2ccc(C(N)=O)c(C(=O)OCCOC(=O)C(=C)C)c2)ccc1C(C)=O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ POLB P06746 3/20 0.39
▸ TDP1 Q9NUW8 2/20 0.39
▸ APEX1 P27695 1/20 0.39
▸ HTT P42858 1/20 0.39
▸ L3MBTL1 Q9Y468 2/20 0.38
▸ MAPT P10636 2/20 0.38
▸ THRB P10828 1/20 0.36
▸ CA1 P00915 1/20 0.35
▸ CA2 P00918 1/20 0.35
▸ SERPINE1 P05121 1/20 0.35
▸ TSHR P16473 4/20 0.33
▸ MAPK1 P28482 2/20 0.32
▸ ALDH1A1 P00352 2/20 0.32
▸ CYP3A4 P08684 1/20 0.32
▸ HPGD P15428 1/20 0.32
▸ KDM4E B2RXH2 1/20 0.32
▸ HSD17B10 Q99714 1/20 0.32
▸ KDR P35968 1/20 0.31
▸ MAOB P27338 2/20 0.31
▸ PARP15 Q460N3 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20061899 0.85 POLB (0.48) POLBTDP1APEX1HTTL3MBTL1
SCHEMBL20061898 0.82 TDP1 (0.46) POLBTDP1APEX1HTTL3MBTL1
SCHEMBL19795529 0.82 TDP1 (0.48) POLBTDP1APEX1HTTL3MBTL1
SCHEMBL9906831 0.81 POLB (0.46) POLBTDP1APEX1HTTL3MBTL1
SCHEMBL16978024 0.80 MAPK1 (0.40) TDP1L3MBTL1MAPTMAPK1MEN1
SCHEMBL19320455 0.78 THRB (0.49) POLBTDP1APEX1HTTL3MBTL1
SCHEMBL14502945 0.78 TDP1 (0.44) POLBTDP1APEX1HTTL3MBTL1
SCHEMBL10040690 0.77 THRB (0.53) POLBTDP1APEX1HTTL3MBTL1
SCHEMBL19795530 0.76 TDP1 (0.39) TDP1L3MBTL1MAPTMAPK1MEN1
SCHEMBL24245300 0.75 POLB (0.45) POLBTDP1APEX1HTTL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180118887-A1 PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 — — US disclosed
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