SCHEMBL203335

SCHEMBL203335

CO[Si](C)(CC1CO1)OC

nearest known ligand 0.36

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.36
TSHR P16473 2/20 0.33
TDP1 Q9NUW8 2/20 0.33
MAPK1 P28482 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL637425 0.79 ALDH1A1 (0.36) ALDH1A1TSHRTDP1MAPK1SMN1; SMN2
SCHEMBL27731585 0.79 ALDH1A1 (0.36) ALDH1A1TSHRTDP1MAPK1SMN1; SMN2
SCHEMBL198113 0.79 ALDH1A1 (0.36) ALDH1A1TSHRTDP1MAPK1SMN1; SMN2
SCHEMBL3068447 0.79
SCHEMBL1225396 0.75 ALDH1A1 (0.36) ALDH1A1TSHRTDP1MAPK1SMN1; SMN2
SCHEMBL662055 0.75 ALDH1A1 (0.33) ALDH1A1TSHRTDP1MAPK1SMN1; SMN2
Cyclopropane SCHEMBL3461994 0.75 ALDH1A1 (0.33) ALDH1A1TSHRTDP1MAPK1SMN1; SMN2
SCHEMBL1225465 0.75
SCHEMBL3064693 0.75 SMN1; SMN2 (0.34) ALDH1A1TSHRTDP1MAPK1SMN1; SMN2
SCHEMBL10602515 0.75 ALDH1A1 (0.38) ALDH1A1TSHRTDP1MAPK1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 94 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109135247-A High thermal conductivity calking boundary material and preparation method thereof 平湖阿莱德实业有限公司 2019-01-04 CN claimed
US-20180333347-A1 PHOTOCHEMICALLY STABLE, NON-LEACHING SUNSCREENS FROM EPOXIDE-BASED SILANE COUPLING AGENTS AND UV ABSORBING CHROMOPHORES ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIVERSITY OF ARIZONA 2018-11-22 US claimed
CN-106800655-A A kind of organic silicon rigidity-increasing stick and preparation method thereof and a kind of silica-gel composition 比亚迪股份有限公司 2017-06-06 CN claimed
EP-1778808-B1 UV-ABSORBING COATINGS AND METHODS OF MAKING THE SAME GUARDIAN INDUSTRIES (US) 2011-03-23 EP claimed
CN-100478393-C Organosilicon modified carbonyl epoxy composite material GUANGZHOU INST CHEMISTRY CAS (CN) 2009-04-15 CN claimed
CN-1847309-A Organosilicon modified carbonyl epoxy composite material GUANGZHOU INST CHEMISTRY CAS (CN) 2006-10-18 CN claimed
US-12343424-B2 Photochemically stable, non-leaching, bridged polysilsesquioxane based sunscreens ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIVERSITY OF ARIZONA (US) 2025-07-01 US disclosed
CN-118159625-A Flame retardant composition, flame retardant resin composition, and molded article 株式会社ADEKA 2024-06-07 CN disclosed
CN-115003759-B Resin composition, method for producing same, and multicomponent curable resin composition 株式会社钟化 2023-12-01 CN disclosed
CN-116917368-A Curable resin composition and use thereof 株式会社钟化 2023-10-20 CN disclosed
CN-116601267-A Flame retardant composition, flame-retardant resin composition, and molded article 株式会社ADEKA 2023-08-15 CN disclosed
CN-112292426-B Polyphosphoric acid amine salt composition, polyphosphoric acid amine salt flame retardant composition, flame-retardant synthetic resin composition containing same, and molded article thereof 株式会社ADEKA 2023-06-23 CN disclosed
CN-114008113-B Resin composition, method for producing same, and multicomponent curable resin composition 株式会社钟化 2023-05-02 CN disclosed
US-20040198925-A1 Curable epoxy resin composition DOW TORAY CO., LTD. (JP) 2004-10-07 US disclosed
WO-2003072656-A1 SILICONE RESIN COMPOSITION, CURABLE RESIN COMPOSITION, AND CURED RESIN DOW CORNING TORAY SILICONE CO., LTD. (JP) 2003-09-04 WO disclosed
CN-1362459-A Adhesive for anisotropic circuit connection, circuit board connection method, and connector HITACHI CHEMICAL CO LTD (JP) 2002-08-07 CN disclosed
US-5952439-A A CURABLE RESIN BLENDS COMPRISING TRIFUNCTIONAL SILOXANE UNIT AND HAS A DISTINCT GLASS-TRANSITION TEMPERATURE IN THE RANGE OF-90.DEGREE. C. TO 150.DEGREE. C.; THE CURED MOLDING RESIN THAT IS FLEXIBLE, WATERPROOFING, RESISTANT TO HEAT SHOCK DOW CORNING TORAY SILICONE CO., LTD. (JP) 1999-09-14 US disclosed
EP-0620242-B1 Epoxy group-containing silicone resin and compositions based thereon DOW CORNING TORAY SILICONE (JP) 1998-08-19 EP disclosed
US-5516858-A CURABLE MOLDING MATERIALS DOW CORNING TORAY SILICONE CO., LTD. (JP) 1996-05-14 US disclosed
EP-0620242-A2 Epoxy group-containing silicone resin and compositions based thereon Dow Corning Toray Silicone Company, Limited (JP) 1994-10-19 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12343424-B2 Photochemically stable, non-leaching, bridged polysilsesquioxane based sunscreens SQLE, STS, DSG1 ALDH1A1 1153/4885TSHR 4630/4885TDP1 1765/4885
US-20180333347-A1 PHOTOCHEMICALLY STABLE, NON-LEACHING SUNSCREENS FROM EPOXIDE-BASED SILANE COUPLING AGENTS AND UV ABSORBING CHROMOPHORES CCNE2, SUN2, CCNE1 ALDH1A1 173/4885TSHR 4816/4885TDP1 3117/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.