Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.58 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.58 |
| ▸ | ESR1 | P03372 | 3/20 | 0.54 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.54 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.50 |
| ▸ | CASP1 | P29466 | 2/20 | 0.50 |
| ▸ | RECQL | P46063 | 1/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.41 |
| ▸ | CA12 | O43570 | 1/20 | 0.41 |
| ▸ | CA1 | P00915 | 1/20 | 0.41 |
| ▸ | CA2 | P00918 | 1/20 | 0.41 |
| ▸ | CA7 | P43166 | 1/20 | 0.41 |
| ▸ | CA9 | Q16790 | 1/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.41 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.41 |
| ▸ | MAOA | P21397 | 3/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.38 |
| ▸ | TP53 | P04637 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29408726 | 1.00 | TSHR (0.58) | TSHRMAPK1ESR1ESR2CYP3A4 | |
| SCHEMBL31476400 | 0.98 | TSHR (0.60) | TSHRMAPK1ESR1ESR2CYP3A4 | |
| SCHEMBL29374282 | 0.98 | TSHR (0.60) | TSHRMAPK1ESR1ESR2CYP3A4 | |
| SCHEMBL125232 | 0.98 | TSHR (0.60) | TSHRMAPK1ESR1ESR2CYP3A4 | |
| SCHEMBL126640 | 0.93 | ESR1 (0.57) | TSHRMAPK1ESR1ESR2CYP3A4 | |
| SCHEMBL1725375 | 0.93 | ESR1 (0.57) | TSHRMAPK1ESR1ESR2CYP3A4 | |
| SCHEMBL29408725 | 0.93 | ESR1 (0.57) | TSHRMAPK1ESR1ESR2CYP3A4 | |
| SCHEMBL22023062 | 0.92 | ESR1 (0.57) | TSHRMAPK1ESR1ESR2CYP3A4 | |
| SCHEMBL4738363 | 0.92 | ESR1 (0.57) | TSHRMAPK1ESR1ESR2CYP3A4 | |
| SCHEMBL718562 | 0.91 | TSHR (0.54) | TSHRMAPK1ESR1ESR2CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 257 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260022208-A1 | POLYIMIDE RESIN, POLYIMIDE VARNISH, POLYIMIDE FILM, AND TEMPORARY FIXING MATERIAL COMPOSITION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-01-22 | — | — | US | disclosed |
| EP-4588955-A1 | POLYIMIDE RESIN, POLYIMIDE VARNISH, POLYIMIDE FILM, AND TEMPORARY FIXING MATERIAL COMPOSITION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-07-23 | — | — | EP | disclosed |
| WO-2024150769-A1 | WIRING FORMING MEMBER, METHOD FOR FORMING WIRING LAYER, AND WIRING FORMED MEMBER | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| WO-2024143295-A1 | TRANSPARENT FILM, HARD COAT FILM, AND DISPLAY | 株式会社カネカ | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143296-A1 | LAMINATE AND DISPLAY | 株式会社カネカ | 2024-07-04 | — | — | WO | disclosed |
| US-12024624-B2 | Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package | RESONAC CORPORATION (JP) | 2024-07-02 | — | — | US | disclosed |
| US-20240199878-A1 | RESIN COMPOSITION, FORMED ARTICLE AND FILM | KANEKA CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| WO-2024111380-A1 | RESIN COMPOSITION, RESIN FILM, PREPREG, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2024-05-30 | — | — | WO | disclosed |
| EP-4368674-A1 | RESIN COMPOSITION, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | Resonac Corporation (JP) | 2024-05-15 | — | — | EP | disclosed |
| WO-2024080195-A1 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2024-04-18 | — | — | WO | disclosed |
| US-5480965-A | BASED ON A NOVEL DIAMINO COMPOUND DERIVED FROM BENZOPHENONE STRUCTURE; FIBER REINFORCEMENT | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-01-02 | — | — | US | disclosed |
| US-5410084-A | Diamine having perfluoro group; colorless, transparent, heat resistant,low dielectric constant | MITSUI TOATSU CHEMICALS, INC. (JP) | 1995-04-25 | — | — | US | disclosed |
| EP-0639621-A2 | Polyimide-based resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1995-02-22 | — | — | EP | disclosed |
| US-5354839-A | Low dielectric constant, colorless, transparent and excellent in processability and heat resistance | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1994-10-11 | — | — | US | disclosed |
| US-5321096-A | Good processability and heat stability | MITSUI TOATSU CHEMICAL, INCORPORATED (JP) | 1994-06-14 | — | — | US | disclosed |
| EP-0572196-A1 | Polyimide, and preparation process of same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-12-01 | — | — | EP | disclosed |
| EP-0565352-A2 | Aromatic diamine and polyimde, and preparation process of same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-10-13 | — | — | EP | disclosed |
| EP-0564299-A2 | Polyimide composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-10-06 | — | — | EP | disclosed |
| EP-0553612-A2 | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides | HITACHI CHEMICAL CO., LTD. (JP) | 1993-08-04 | — | — | EP | disclosed |
| US-5212279-A | Hot-melt adhesive and its use in polyimide film and printed circuit board | HITACHI CHEMICAL CO., LTD. (JP) | 1993-05-18 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260022208-A1 | POLYIMIDE RESIN, POLYIMIDE VARNISH, POLYIMIDE FILM, AND TEMPORARY FIXING MATERIAL COMPOSITION | SETDB1, FEM1B, F9 | TSHR 2551/4885MAPK1 3153/4885ESR1 2797/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.