SCHEMBL3175501

SCHEMBL3175501

FC(F)(F)c1ccc([Si](Cl)(Cl)Cl)cc1

nearest known ligand 0.48

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
KIF11 P52732 6/20 0.48
ALDH1A1 P00352 1/20 0.46
TSHR P16473 1/20 0.46
CES2 O00748 1/20 0.42
CES1 P23141 1/20 0.42
ORAI1 Q96D31 1/20 0.42
ORAI2 Q96SN7 1/20 0.42
ORAI3 Q9BRQ5 1/20 0.42
TRPV6 Q9H1D0 1/20 0.42
MGLL Q99685 1/20 0.42
TAAR1 Q96RJ0 1/20 0.39
AHR P35869 1/20 0.39
HAO1 Q9UJM8 1/20 0.38
CYP19A1 P11511 1/20 0.38
PTPN5 P54829 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15084991 0.79 PDE2A (0.46) KIF11PTPN5
SCHEMBL63468 0.78 ALDH1A1 (0.67) KIF11ALDH1A1TSHRCES2CES1
SCHEMBL24032707 0.77 KIF11 (0.52) KIF11ALDH1A1TSHRCES2CES1
SCHEMBL3167629 0.76 CES2 (0.41) ALDH1A1TSHRCES2PTPN5
SCHEMBL131968 0.76 TSHR (0.48) KIF11ALDH1A1TSHR
SCHEMBL23040284 0.75 NR1H2 (0.63)
SCHEMBL19097697 0.74 KIF11 (0.50) KIF11ALDH1A1TSHRCES2CES1
SCHEMBL7734267 0.74 TSHR (0.48) KIF11ALDH1A1TSHRCES2MGLL
SCHEMBL20580214 0.74 KIF11 (0.40) KIF11ALDH1A1TSHRCES2CES1
SCHEMBL28231186 0.74 KIF11 (0.40) KIF11ALDH1A1TSHRCES2CES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112739775-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-11-01 CN disclosed
CN-112739776-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-10-28 CN disclosed
CN-112739748-B Curable polysilsesquioxane compound, curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-07-12 CN disclosed
US-11315899-B2 Die bonding material, light-emitting device, and method for producing light-emitting device LINTEC CORPORATION (JP) 2022-04-26 US disclosed
CN-108368346-B Curable composition, method for producing curable composition, cured product, method for using curable composition, and optical device 琳得科株式会社 2021-07-13 CN disclosed
CN-112739748-A Curable polysilsesquioxane compound, curable composition, cured product, and method for using curable composition 琳得科株式会社 2021-04-30 CN disclosed
CN-112739776-A Curable composition, cured product, and method for using curable composition 琳得科株式会社 2021-04-30 CN disclosed
CN-112739775-A Curable composition, cured product, and method for using curable composition 琳得科株式会社 2021-04-30 CN disclosed
US-10920117-B2 Curable composition, method for producing curable composition, cured product, use of curable composition, and optical device LINTEC CORPORATION (JP) 2021-02-16 US disclosed
US-20200335471-A1 DIE BONDING MATERIAL, LIGHT-EMITTING DEVICE, AND METHOD FOR PRODUCING LIGHT-EMITTING DEVICE LINTEC CORPORATION (JP) 2020-10-22 US disclosed
US-20090278254-A1 Dielectric materials and methods for integrated circuit applications SILECS OY (FI) 2009-11-12 US disclosed
US-20090278254-A1 Dielectric materials and methods for integrated circuit applications SILECS OY (FI) 2009-11-12 US disclosed
US-20070190800-A1 Low-k dielectric material SILECS OY (FI) 2007-08-16 US disclosed
US-20070190800-A1 Low-k dielectric material SILECS OY (FI) 2007-08-16 US disclosed
US-20070063188-A1 Low-k dielectric material SILECS OY (FI) 2007-03-22 US disclosed
US-20070063188-A1 Low-k dielectric material SILECS OY (FI) 2007-03-22 US disclosed
US-20050064726-A1 Method of forming low-k dielectrics SILECS OY (FI) 2005-03-24 US disclosed
US-20050032357-A1 Dielectric materials and methods for integrated circuit applications SILECS OY (FI) 2005-02-10 US disclosed
WO-2005004221-A2 LOW-K-DIELECTRIC MATERIAL SILECS OY (FI) 2005-01-13 WO disclosed
WO-2004090936-A2 LOW-K DIELECTRIC MATERIAL SILECS OY (FI) 2004-10-21 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20070063188-A1 Low-k dielectric material KCNH3, KCNH2, KCNN3 KIF11 2494/4885ALDH1A1 2343/4885TSHR 4406/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.