SCHEMBL206150

SCHEMBL206150

CCCCN(C1CC(C)(C)NC(C)(C)C1)C1CC(C)(C)NC(C)(C)C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6124306 0.84 ALOX15 (0.32)
SCHEMBL2252788 0.82
SCHEMBL20018683 0.81 ALOX15 (0.31)
SCHEMBL248382 0.79 CHRM2 (0.38)
SCHEMBL22334894 0.78
SCHEMBL8642603 0.78 GAA (0.30)
SCHEMBL22597519 0.77 DNM1 (0.40)
SCHEMBL9491908 0.77 HTR1A (0.30)
SCHEMBL3840954 0.77 ADH1A (0.53)
SCHEMBL9333994 0.77 L3MBTL1 (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 160 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240409712-A1 RESIN COMPOSITION AND OPTICAL ELEMENT ZEON CORPORATION (JP) 2024-12-12 US disclosed
EP-4424776-A1 RESIN COMPOSITION AND OPTICAL ELEMENT Zeon Corporation (JP) 2024-09-04 EP disclosed
EP-3321323-B1 RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND OPTICAL MEMBER ZEON CORP (JP) 2024-01-17 EP disclosed
EP-2930210-B1 RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONICS DEVICES AND ORGANIC ELECTRONICS DEVICE ZEON CORP (JP) 2023-01-25 EP disclosed
US-10707442-B2 Composite gas barrier multilayer body, method for producing the same, and composite electrode ZEON CORPORATION (JP) 2020-07-07 US disclosed
EP-3089551-B1 SEALING FILM, ORGANIC ELECTROLUMINESCENT DISPLAY, AND ORGANIC SEMICONDUCTOR DEVICE ZEON CORP (JP) 2020-04-15 EP disclosed
US-10559778-B2 Composite gas barrier laminate and method for producing same ZEON CORPORATION (JP) 2020-02-11 US disclosed
US-20190334116-A1 METHOD FOR MANUFACTURING SEALING MATERIAL, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE ZEON CORPORATION (JP) 2019-10-31 US disclosed
US-10374190-B2 Sealing film, organic electroluminescent display, and organic semiconductor device ZEON CORPORATION (JP) 2019-08-06 US disclosed
US-10365411-B2 Hardcoat film, polarizing plate, liquid crystal display, and method for manufacturing hardcoat film FUJIFILM CORPORATION (JP) 2019-07-30 US disclosed
US-20050219683-A1 Objective lens and optical pickup apparatus KONICA MINOLTA OPTO, INC. 2005-10-06 US disclosed
US-20050201422-A1 Optical element and optical pickup apparatus KONICA MINOLTA OPTO, INC. (JP) 2005-09-15 US disclosed
US-20050190463-A1 Optical element and manufacturing method of the optical element KONICA MINOLTA OPTO, INC. 2005-09-01 US disclosed
US-20050063281-A1 Optical pickup apparatus, optical element for optical pickup apparatus and producing method of optical element KONICA MINOLTA OPTO, INC. 2005-03-24 US disclosed
US-20050063282-A1 Diffractive optical element and optical pickup apparatus KONICA MINOLTA OPTO, INC. 2005-03-24 US disclosed
US-20050047315-A1 Semiconductor laser light source device and optical pickup device KONICA MINOLTA OPTO, INC. 2005-03-03 US disclosed
US-20030207983-A1 Block copolymer, process for producing the same, and molded object ZEON CORPORATION (JP) 2003-11-06 US disclosed
US-20030158307-A1 Resin composition ZEON CORPORATION (JP) 2003-08-21 US disclosed
EP-1310513-A1 BLOCK COPOLYMER, PROCESS FOR PRODUCING THE SAME, AND MOLDED OBJECT Zeon Corporation (JP) 2003-05-14 EP disclosed
EP-1291386-A1 RESIN COMPOSITION ZEON CORPORATION (JP) 2003-03-12 EP disclosed