SCHEMBL2102165

SCHEMBL2102165

CCC[SiH](NCNCC)c1ccccc1

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.31
HTT P42858 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2101841 0.90 SIGMAR1 (0.34)
SCHEMBL2102345 0.85 GAA (0.33) GAAHTT
SCHEMBL2267110 0.85 KCNN4 (0.33) GAA
SCHEMBL2100789 0.77 GAA (0.34) GAAHTT
SCHEMBL2101040 0.76 GAA (0.33) GAAHTT
SCHEMBL2267562 0.75 LMNA (0.33)
SCHEMBL2268688 0.74 SIGMAR1 (0.34) GAAHTT
SCHEMBL2100481 0.74 CACNA2D1 (0.36)
SCHEMBL2102746 0.73 GAA (0.32) GAAHTT
SCHEMBL2103817 0.71 KCNN4 (0.33) GAAHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed