SCHEMBL2102665

SCHEMBL2102665

CCC[Si](Cl)(c1ccccc1)N(CC)CC

nearest known ligand 0.31

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
NR1H2 P55055 1/20 0.30
NR1H3 Q13133 1/20 0.30
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2102086 0.89 TSHR (0.35) TSHR
SCHEMBL2104189 0.84 TSHR (0.31) TSHR
SCHEMBL2102658 0.82 ALDH1A1 (0.31) TSHR
SCHEMBL2104384 0.76 ALDH1A1 (0.32) TSHR
SCHEMBL2273997 0.76 MAPT (0.33) TSHR
SCHEMBL2101652 0.76
SCHEMBL2101359 0.75 TSHR (0.33) TSHR
SCHEMBL2101348 0.75 TP53 (0.33) TSHR
SCHEMBL2100486 0.75 TSHR (0.33) TSHR
SCHEMBL2101600 0.74 NR1I2 (0.36) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed