SCHEMBL2108805

SCHEMBL2108805

O=c1cc(Cl)sn1-c1ccc(Cl)c(Cl)c1

nearest known ligand 0.73

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
KAT2B Q92831 6/20 0.73
RGS4 P49798 3/20 0.47
RGS8 P57771 3/20 0.47
PIN1 Q13526 1/20 0.42
KMT2A Q03164 2/20 0.41
MEN1 O00255 1/20 0.41
CA12 O43570 1/20 0.39
CA1 P00915 1/20 0.39
CA9 Q16790 1/20 0.39
MAPT P10636 1/20 0.38
BCL2A1 Q16548 1/20 0.38
ADAM17 P78536 1/20 0.38
PHOSPHO1 Q8TCT1 1/20 0.38
RAD51 Q06609 1/20 0.37
SLC6A2 P23975 2/20 0.37
SLC6A4 P31645 2/20 0.37
SLC6A3 Q01959 1/20 0.37
ADRB1 P08588 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7623894 0.81 KAT2B (0.67) KAT2BRGS4RGS8KMT2AMEN1
SCHEMBL12632651 0.78 KAT2B (0.61) KAT2BRGS4RGS8KMT2AMEN1
SCHEMBL11193393 0.77 KAT2B (0.60) KAT2BRGS4RGS8CA12CA1
SCHEMBL9130886 0.74 KAT2B (0.73) KAT2BRGS4RGS8PIN1KMT2A
SCHEMBL21887490 0.74 KAT2B (0.56) KAT2BKMT2AMEN1CA12CA1
SCHEMBL1533543 0.73 KAT2B (1.00) KAT2BKMT2AMEN1MAPTPHOSPHO1
SCHEMBL9518699 0.70 KAT2B (0.50) KAT2BKMT2AMEN1CA12CA1
SCHEMBL465905 0.70 KAT2B (0.54) KAT2BKMT2AMEN1CA12CA1
SCHEMBL21886954 0.68 KAT2B (0.50) KAT2BCA1
SCHEMBL8369477 0.68 PHOSPHO1 (0.76) KAT2BMAPTPHOSPHO1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8157877-B2 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion JSR CORPORATION (JP) 2012-04-17 US disclosed
US-20090325323-A1 AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, PRODUCTION METHOD THEREOF, AND CHEMICAL MECHANICAL POLISHING METHOD JSR CORPORATION (JP) 2009-12-31 US disclosed
US-20090165395-A1 CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION, CHEMICAL MECHANICAL POLISHING METHOD, AND KIT FOR PREPARING CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION JSR CORPORATION (JP) 2009-07-02 US disclosed
EP-1962334-A1 AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING JSR Corporation (JP) 2008-08-27 EP disclosed
US-6786944-B2 FOR USE IN MICRO ISOLATING STEP OR A PLANARIZING STEP OF AN INTER LAYER DIELECTRIC IN PRODUCTION OF SEMICONDUCTOR DEVICES JSR CORPORATION (JP) 2004-09-07 US disclosed
EP-1357161-A2 Aqueous dispersion for chemical mechanical polishing JSR Corporation (JP) 2003-10-29 EP disclosed
US-20030196386-A1 Aqueous dispersion for chemical mechanical polishing JSR CORPORATION (JP) 2003-10-23 US disclosed