SCHEMBL2115984

SCHEMBL2115984

COc1cc(C)c(C)c(OC)c1O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 3/20 0.46
MAPT P10636 3/20 0.46
KMT2A Q03164 2/20 0.46
MEN1 O00255 1/20 0.46
POLB P06746 1/20 0.46
HPGD P15428 1/20 0.46
GFER P55789 1/20 0.46
NPSR1 Q6W5P4 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
ACHE P22303 1/20 0.43
ALOX5 P09917 2/20 0.41
GAA P10253 2/20 0.41
KDM4E B2RXH2 1/20 0.41
PTGS2 P35354 2/20 0.41
CA12 O43570 1/20 0.41
CA1 P00915 1/20 0.41
CA2 P00918 1/20 0.41
CA3 P07451 1/20 0.41
PKM P14618 1/20 0.41
CA4 P22748 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1808984 0.89 EPHX2 (0.49) CYP3A4MAPTKMT2AMEN1POLB
Benzene SCHEMBL28616661 0.85 EPHX2 (0.46) CYP3A4MAPTKMT2AMEN1POLB
SCHEMBL3678118 0.84 MAPT (0.48) CYP3A4MAPTKMT2AMEN1POLB
SCHEMBL12587650 0.83 MAPT (0.52) CYP3A4MAPTKMT2AMEN1POLB
SCHEMBL15691047 0.82 CYP3A4 (0.47) CYP3A4MAPTKMT2AMEN1POLB
SCHEMBL5588406 0.81 CYP3A4 (0.50) CYP3A4MAPTKMT2AMEN1POLB
SCHEMBL684134 0.80 MAPT (0.48) CYP3A4MAPTKMT2AMEN1POLB
SCHEMBL10584398 0.79 ACHE (0.48) CYP3A4MAPTKMT2AMEN1POLB
SCHEMBL12586888 0.79 ACHE (0.54) CYP3A4MAPTKMT2AMEN1POLB
SCHEMBL27984936 0.79 ALOX5 (0.47) CYP3A4MAPTACHEALOX5GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 492 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117806123-B Chemical amplification type negative photosensitive polyimide composition and application thereof 明士(北京)新材料开发有限公司 2024-05-31 CN claimed
CN-117806123-A Chemical amplification type negative photosensitive polyimide composition and application thereof 明士(北京)新材料开发有限公司 2024-04-02 CN claimed
CN-115561966-B Chemical amplification type negative photosensitive polyimide coating adhesive and application thereof 明士(北京)新材料开发有限公司 2023-05-16 CN claimed
CN-114874441-A Chemical amplification type positive photosensitive polyimide coating adhesive and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-08-09 CN claimed
CN-114488690-A Chemical amplification type negative polyimide photoresist and preparation method and application thereof 中国科学院化学研究所 2022-05-13 CN claimed
CN-111522200-B Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2021-07-27 CN claimed
CN-111522200-A Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2020-08-11 CN claimed
EP-1806618-B1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR CORP (JP) 2010-06-09 EP claimed
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
EP-3633455-B1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2026-04-08 EP disclosed
US-12529958-B2 Photosensitive resin composition, method for producing resin film having pattern, resin film having pattern, and semiconductor circuit substrate JSR CORPORATION (JP) 2026-01-20 US disclosed
US-20250382492-A1 LAMINATE, METHOD FOR MANUFACTURING LAMINATE, HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT TORAY INDUSTRIES, INC. (JP) 2025-12-18 US disclosed
EP-3859447-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2025-11-19 EP disclosed
US-12473403-B2 Curable resin composition, cured film, laminate, method for manufacturing cured film, semiconductor device, and polymer precursor FUJIFILM CORPORATION (JP) 2025-11-18 US disclosed
CN-1457454-A Precursor composition for positive photosensitive resin and display made with the same TORAY INDUSTRIES (JP) 2003-11-19 CN disclosed
US-20030194631-A1 Precursor composition for positive photosensitive resin and display made with the same TORAY INDUSTRIES, INC. (JP) 2003-10-16 US disclosed
US-6593043-B2 Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. TORAY INDUSTRIES, INC. (JP) 2003-07-15 US disclosed
US-20020090564-A1 Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. TORAY INDUSTRIES, INC. (JP) 2002-07-11 US disclosed
CN-1356356-A Normal Photosensitive resin precursor composition and display using it TORAY INDUSTRIES (JP) 2002-07-03 CN disclosed
EP-1209523-A2 Composition of positive photosensitive resin precursor, and display device made thereof TORAY INDUSTRIES, INC. (JP) 2002-05-29 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12529958-B2 Photosensitive resin composition, method for producing resin film having pattern, resin film having pattern, and semiconductor circuit substrate RER1, ASH2L, ASIC1 CYP3A4 2487/4885MAPT 2830/4885KMT2A 369/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.