SCHEMBL21179463

SCHEMBL21179463

COC(=O)C(C)[SiH2]OC(C)(C)C

nearest known ligand 0.37

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 3/20 0.37
CA14 Q9ULX7 4/20 0.36
CA12 O43570 3/20 0.36
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
DGAT1 O75907 1/20 0.31
CA7 P43166 1/20 0.30
CA9 Q16790 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28897934 0.81 TSHR (0.36)
SCHEMBL10798382 0.81 SMN1; SMN2 (0.35) SMN1; SMN2CA14CA12
SCHEMBL21177901 0.79 ALOX15 (0.38) SMN1; SMN2
SCHEMBL22614787 0.76 HCAR2 (0.32)
SCHEMBL21177751 0.74 ALDH1A1 (0.42) SMN1; SMN2CA1CA2
SCHEMBL21180339 0.73 SMN1; SMN2 (0.39) SMN1; SMN2CA14CA12
SCHEMBL21177514 0.72 NAAA (0.42)
SCHEMBL21177761 0.71 NAAA (0.44)
SCHEMBL381977 0.67 SMN1; SMN2 (0.38) SMN1; SMN2CA14CA12CA1CA2
SCHEMBL1066632 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11702574-B2 Adhesive silicone composition and an adhesive film or tape SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-07-18 US disclosed
CN-111601866-B Silicone adhesive composition, cured product, adhesive film, and adhesive tape 信越化学工业株式会社 2022-09-06 CN disclosed
US-20200347281-A1 ADHESIVE SILICONE COMPOSITION AND AN ADHESIVE FILM OR TAPE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-11-05 US disclosed
CN-111601866-A Silicone adhesive composition, adhesive film, and adhesive tape 信越化学工业株式会社 2020-08-28 CN disclosed
WO-2019142779-A1 SILICONE ADHESIVE COMPOSITION, ADHESIVE FILM, AND ADHESIVE TAPE 信越化学工業株式会社 2019-07-25 WO disclosed