SCHEMBL21662880

SCHEMBL21662880

CN1CCCCC(C2CCCC(C3CCCCCC(C)(C)O3)CC(C)(C)N2)CC1(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26705151 0.69 ALPL (0.31)
SCHEMBL10489343 0.69 ALDH1A1 (0.32)
SCHEMBL10989392 0.64 ALDH1A1 (0.30)
SCHEMBL10989560 0.63 L3MBTL1 (0.32)
SCHEMBL15129694 0.62 ALDH1A1 (0.32)
SCHEMBL25810635 0.62 L3MBTL1 (0.31)
SCHEMBL18125569 0.61 L3MBTL1 (0.33)
SCHEMBL31504304 0.60 SIGMAR1 (0.31)
SCHEMBL31504273 0.58 ALDH1A1 (0.30)
SCHEMBL15280175 0.58 ALDH1A1 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-20200041903-A1 POLYMER HAVING A STRUCTURE OF POLYAMIDE, POLYAMIDE-IMIDE, OR POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, PHOTOSENSITIVE DRY FILM, AND PROTECTIVE FILM FOR ELECTRIC AND ELECTRONIC PARTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-02-06 US disclosed