SCHEMBL21662886

SCHEMBL21662886

CC1(C)CSc2ccccc2C1

nearest known ligand 0.37

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
RYR2 Q92736 3/20 0.37
ALDH1A1 P00352 1/20 0.33
HPGD P15428 1/20 0.33
ALOX12 P18054 1/20 0.33
MEN1 O00255 1/20 0.33
GAA P10253 1/20 0.33
MAPT P10636 1/20 0.33
KMT2A Q03164 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
HTR2A P28223 1/20 0.31
HSD17B3 P37058 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9148372 0.80 MAPT (0.37) ALDH1A1HPGDALOX12MEN1GAA
SCHEMBL9140221 0.73 MAPT (0.42) ALDH1A1HPGDMEN1GAAMAPT
SCHEMBL8707641 0.71 HTR1A (0.40) HTR2A
SCHEMBL18828548 0.70 ALDH1A1 (0.52) RYR2ALDH1A1HPGDALOX12MEN1
SCHEMBL9418962 0.67 HTR2A (0.37) HTR2A
SCHEMBL2632864 0.67 RARA (0.39) ALDH1A1HPGDALOX12NPSR1HTR2A
SCHEMBL597727 0.67 ADRA2A (0.43)
SCHEMBL31087508 0.67 ALDH1A1 (0.37) ALDH1A1HPGDALOX12GAANPSR1
SCHEMBL25798284 0.67 ALDH1A1 (0.37) ALDH1A1HPGDALOX12HTR2A
SCHEMBL25744884 0.67 ALDH1A1 (0.37) ALDH1A1HPGDALOX12HTR2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350294-A1 Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-20200041903-A1 POLYMER HAVING A STRUCTURE OF POLYAMIDE, POLYAMIDE-IMIDE, OR POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, PHOTOSENSITIVE DRY FILM, AND PROTECTIVE FILM FOR ELECTRIC AND ELECTRONIC PARTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-02-06 US disclosed