SCHEMBL217303

SCHEMBL217303

Cc1c([N+](=O)[O-])cc(S(=O)(=O)OCc2ccccc2)cc1[N+](=O)[O-]

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.49
KMT2A Q03164 6/20 0.46
ALDH1A1 P00352 4/20 0.46
MEN1 O00255 4/20 0.46
MAPT P10636 3/20 0.46
LMNA P02545 2/20 0.46
MAPK1 P28482 2/20 0.46
NPC1 O15118 2/20 0.46
RAB9A P51151 2/20 0.46
MITF O75030 1/20 0.46
HTT P42858 1/20 0.46
CCR6 P51684 1/20 0.46
NPSR1 Q6W5P4 1/20 0.46
VCAM1 P19320 1/20 0.43
CYP1A2 P05177 1/20 0.43
CYP3A4 P08684 1/20 0.43
CYP2D6 P10635 1/20 0.43
CYP2C9 P11712 1/20 0.43
CYP2C19 P33261 1/20 0.43
HIF1A Q16665 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27966350 0.83 MAPT (0.48) POLBKMT2AALDH1A1MEN1MAPT
SCHEMBL28212566 0.82 VCAM1 (0.55) POLBKMT2AALDH1A1MEN1MAPT
SCHEMBL6513510 0.81 CA1 (0.41) POLBKMT2AALDH1A1MEN1MAPT
SCHEMBL28845039 0.81 KMT2A (0.49) POLBKMT2AALDH1A1MEN1NPC1
SCHEMBL2431717 0.80 ALDH1A1 (0.45) POLBKMT2AALDH1A1MEN1MAPT
SCHEMBL7790404 0.80 ALDH1A1 (0.48) KMT2AALDH1A1MEN1MAPTLMNA
SCHEMBL9508889 0.78 ALPL (0.46) POLBKMT2AALDH1A1MEN1MAPT
SCHEMBL27724423 0.78 HTT (0.55) KMT2AALDH1A1MEN1MAPTLMNA
Dinitrophenylene SCHEMBL27775687 0.77 CYP1A2 (0.55) KMT2AALDH1A1LMNAHTTCYP1A2
SCHEMBL1732920 0.77 CYP19A1 (0.52) POLBKMT2AALDH1A1MEN1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2387735-B1 NONPOLYMERIC BINDERS FOR SEMICONDUCTOR SUBSTRATE COATINGS FUJIFILM ELECTRONIC MAT USA INC (US) 2019-03-13 EP disclosed
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
EP-1788436-B1 Rework process for photoresist film SHINETSU CHEMICAL CO (JP) 2013-01-09 EP disclosed
EP-1813985-B1 Antireflection film composition, substrate, and pattering process SHINETSU CHEMICAL CO (JP) 2012-10-31 EP disclosed
US-8288072-B2 Antireflection film; fast etching speed whcih reduces deformation; accuracy; 2,3-epoxypropyl methacrylate ester-styrene copolymer SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-10-16 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
US-8088554-B2 Bottom resist layer composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD (JP) 2012-01-03 US disclosed
EP-2387735-A1 NONPOLYMERIC BINDERS FOR SEMICONDUCTOR SUBSTRATE COATINGS FujiFilm Electronic Materials USA, Inc. (US) 2011-11-23 EP disclosed
US-8037621-B2 Article of footwear including a woven strap system NIKE, INC. (US) 2011-10-18 US disclosed
US-20070117411-A1 Rework process for photoresist film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-24 US disclosed
EP-1788436-A1 Rework process for photoresist film Shin-Etsu Chemical Company, Ltd. (JP) 2007-05-23 EP disclosed
EP-1788437-A2 Rework process for photoresist film Shinetsu Chemical Co., Ltd. (JP) 2007-05-23 EP disclosed
US-20070111140-A1 Resist composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-17 US disclosed
US-20070111134-A1 solvent remove the first photoresist film, forming a second photoresist film over the second antireflection silicone resin film which is over the first antireflection silicone resin film; lower cost and provide an excellent resist pattern SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-17 US disclosed
US-7189493-B2 Polymer, positive resist composition, and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-03-13 US disclosed
US-20060234158-A1 Bottom resist layer composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-10-19 US disclosed
US-20060147836-A1 Resist composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-07-06 US disclosed
US-20050079446-A1 Novel polymerizable compound, polymer, positive-resist composition, and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-04-14 US disclosed
US-20050079440-A1 Novel polymer, positive resist composition, and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-04-14 US disclosed