SCHEMBL21747544

SCHEMBL21747544

COc1ccc(C[N+](C)(C)c2ccccc2)cc1.Fc1c(F)c(F)c([B-](c2c(F)c(F)c(F)c(F)c2F)(c2c(F)c(F)c(F)c(F)c2F)c2c(F)c(F)c(F)c(F)c2F)c(F)c1F

nearest known ligand 0.41

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 2/20 0.41
ACHE P22303 4/20 0.39
SIGMAR1 Q99720 1/20 0.36
CHRNB2 P17787 1/20 0.36
CHRNA7 P36544 1/20 0.36
CHRNA4 P43681 1/20 0.36
HTT P42858 1/20 0.35
CA4 P22748 1/20 0.34
RAB9A P51151 2/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
NPC1 O15118 1/20 0.33
IDO1 P14902 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30283701 0.87 KDM4E (0.41) ACHEHTT
SCHEMBL565171 0.85 LTA4H (0.55) LTA4HACHESIGMAR1HTTCA4
SCHEMBL2289588 0.84 LTA4H (0.58) LTA4HACHESIGMAR1HTTCA4
Hydrochloric Acid SCHEMBL6277766 0.84 LTA4H (0.53) LTA4HACHESIGMAR1HTTCA4
SCHEMBL23069371 0.83 LTA4H (0.49) LTA4HACHESIGMAR1HTTCA4
SCHEMBL21747569 0.83 LTA4H (0.49) LTA4HACHESIGMAR1CHRNB2CHRNA7
Fluoride Ion SCHEMBL4075058 0.82 LTA4H (0.52) LTA4HACHESIGMAR1HTTCA4
SCHEMBL27121989 0.79 LTA4H (0.55) LTA4HACHESIGMAR1HTTCA4
SCHEMBL30540144 0.79 CRHBP (0.41) SIGMAR1CHRNA7HTTL3MBTL1
SCHEMBL21747561 0.78 MEN1 (0.32) ACHEL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117659668-B Low-temperature heat-curable resin composition, anisotropic conductive film, and connection structure 常州德创高新材料科技有限公司 2024-12-06 CN claimed
CN-117659667-B Thermosetting resin composition, anisotropic conductive film, and connection structure 常州德创高新材料科技有限公司 2024-11-01 CN claimed
CN-117659668-A Low-temperature heat-curable resin composition, anisotropic conductive film, and connection structure 常州德创高新材料科技有限公司 2024-03-08 CN claimed
CN-117659667-A Thermosetting resin composition, anisotropic conductive film, and connection structure 常州德创高新材料科技有限公司 2024-03-08 CN claimed
US-12600888-B2 Dual-curable adhesive composition HENKEL AG & CO. KGAA (DE) 2026-04-14 US disclosed
US-12516211-B2 Ink composition and electronic device including film formed using the ink composition SAMSUNG DISPLAY CO., LTD. (KR) 2026-01-06 US disclosed
WO-2025233508-A1 DEBONDING OF A CURED COMPOSITION HENKEL AG & CO. KGAA (DE) 2025-11-13 WO disclosed
CN-115943732-B Sealing agent for organic EL display element 积水化学工业株式会社 2025-05-02 CN disclosed
CN-115777008-B Adhesive film for circuit connection, circuit connection structure, and method for manufacturing same 株式会社力森诺科 2025-03-18 CN disclosed
CN-114286832-B Photocurable resin composition for electronic device 积水化学工业株式会社 2025-03-04 CN disclosed
CN-113811558-B Photocurable resin composition for electronic device 积水化学工业株式会社 2025-01-28 CN disclosed
CN-113454182-B Sealing agent for organic EL display element 积水化学工业株式会社 2025-01-17 CN disclosed
CN-114716648-A Sealing agent for organic electroluminescent display element 积水化学工业株式会社 2022-07-08 CN disclosed
CN-110546183-B Composition for encapsulating organic electronic components 株式会社LG化学 2022-04-26 CN disclosed
CN-114365303-A Sealing agent kit for organic EL display element and organic EL display element 积水化学工业株式会社 2022-04-15 CN disclosed
US-11295999-B2 Composition for encapsulating organic electronic element LG CHEM, LTD. (KR) 2022-04-05 US disclosed
CN-114286832-A Photocurable resin composition for electronic device 积水化学工业株式会社 2022-04-05 CN disclosed
CN-108699216-B Curable resin composition and sealing agent for organic electroluminescent display element 积水化学工业株式会社 2022-03-18 CN disclosed
US-20200127206-A1 COMPOSITION FOR ENCAPSULATING ORGANIC ELECTRONIC ELEMENT LG CHEM, LTD. (KR) 2020-04-23 US disclosed
EP-3613789-A1 COMPOSITION FOR SEALING ORGANIC ELECTRONIC ELEMENT LG Chem, Ltd. (KR) 2020-02-26 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12600888-B2 Dual-curable adhesive composition RCC1, ASIC1, POT1 LTA4H 1253/4885ACHE 2296/4885SIGMAR1 4611/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.