SCHEMBL21753909

SCHEMBL21753909

CCc1cc(-c2ccc3c(c2-c2ccc(N)c(CC)c2)Cc2ccccc2-3)ccc1N

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PNMT P11086 1/20 0.41
PGR P06401 1/20 0.39
NPC1 O15118 3/20 0.38
RAB9A P51151 3/20 0.38
MAPT P10636 3/20 0.38
ALDH1A1 P00352 2/20 0.38
KDM4E B2RXH2 1/20 0.38
LMNA P02545 1/20 0.38
HPGD P15428 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
ADORA2A P29274 1/20 0.35
ADORA1 P30542 1/20 0.35
ALOX5AP P20292 1/20 0.34
FEN1 P39748 1/20 0.34
HTR2B P41595 3/20 0.33
HTR7 P34969 2/20 0.33
HTR2C P28335 2/20 0.33
DRD2 P14416 1/20 0.33
ADRA1D P25100 1/20 0.33
HTR2A P28223 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28224926 0.88 PNMT (0.52) PNMTPGRNPC1RAB9AMAPT
SCHEMBL20640487 0.88 PNMT (0.48) PNMTPGRNPC1RAB9AMAPT
Benzene SCHEMBL28861823 0.87 PNMT (0.51) PNMTPGRNPC1RAB9AMAPT
SCHEMBL27682579 0.85 HSD17B1 (0.47) PNMTPGRNPC1RAB9AMAPT
SCHEMBL28312235 0.84 PNMT (0.43) PNMTPGRNPC1RAB9AMAPT
SCHEMBL28263356 0.83 PNMT (0.41) PNMTPGRNPC1RAB9AHTR2B
SCHEMBL31046749 0.83 PGR (0.44) PNMTPGRNPC1RAB9AMAPT
SCHEMBL7919926 0.83 PGR (0.44) PNMTPGRNPC1RAB9AMAPT
Benzene SCHEMBL28224971 0.82 PGR (0.43) PNMTPGRNPC1RAB9AMAPT
SCHEMBL29800244 0.80 PGR (0.41) PNMTPGRNPC1RAB9AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240191029-A1 HEAT-CURABLE IMIDE RESIN COMPOSITION, AND UNCURED RESIN FILM, CURED RESIN FILM, PREPREG, SUBSTRATE, ADHESIVE AND SEMICONDUCTOR ENCAPSULATION MATERIAL USING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-06-13 US disclosed
CN-118108944-A Thermosetting imide resin composition, and uncured resin film, cured resin film, prepreg, substrate, and adhesive using same 信越化学工业株式会社 2024-05-31 CN disclosed
WO-2020040200-A1 PREPREG 東レ株式会社 2020-02-27 WO disclosed