Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DPP4 | P27487 | 2/20 | 0.44 |
| ▸ | F2 | P00734 | 1/20 | 0.44 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.42 |
| ▸ | TAAR1 | Q96RJ0 | 3/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.41 |
| ▸ | HTR2A | P28223 | 1/20 | 0.41 |
| ▸ | SCN4A | P35499 | 2/20 | 0.41 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.40 |
| ▸ | ADRA2C | P18825 | 1/20 | 0.40 |
| ▸ | POLB | P06746 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16118073 | 0.88 | THRB (0.36) | L3MBTL1LMNA | |
| Benzaldehyde SCHEMBL7800459 | 0.86 | ALDH1A1 (0.47) | L3MBTL1LMNAHTR2ASCN4APOLB | |
| SCHEMBL14174737 | 0.84 | DPP4 (0.38) | DPP4F2TAAR1LMNASCN4A | |
| SCHEMBL5506617 | 0.83 | LMNA (0.42) | DPP4F2LMNAHTR2AADRA2A | |
| SCHEMBL5501342 | 0.79 | LTA4H (0.44) | DPP4F2HTR2A | |
| Ether SCHEMBL28580867 | 0.78 | DPP4 (0.41) | DPP4F2TAAR1LMNAHTR2A | |
| SCHEMBL28866113 | 0.78 | — | — | |
| SCHEMBL5498748 | 0.78 | TAAR1 (0.43) | DPP4F2TAAR1LMNASCN4A | |
| SCHEMBL3170486 | 0.78 | DPP4 (0.52) | DPP4F2L3MBTL1TAAR1LMNA | |
| SCHEMBL5179528 | 0.78 | DPP4 (0.41) | DPP4F2TAAR1LMNAHTR2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 143 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12545810-B2 | Magnetic polishing slurry and method for polishing a workpiece | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2026-02-10 | — | — | US | claimed |
| US-12448542-B2 | Slurry composition for polishing organic film | KCTECH CO., LTD. (KR) | 2025-10-21 | — | — | US | claimed |
| US-12305079-B2 | CMP slurry composition for polishing polycrystalline silicon and polishing method using same | KCTECH CO., LTD. (KR) | 2025-05-20 | — | — | US | claimed |
| US-20250145859-A1 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING | KCTECH CO., LTD. (KR) | 2025-05-08 | — | — | US | claimed |
| EP-4389840-A1 | A CHARACTERISTIC STUDY OF ACRYLIC POLYMER DISPERSANT COATED ON SURFACE OF POLISHING PARTICLE | Hannam University Industry Academy Cooperation Foundation (KR) | 2024-06-26 | — | — | EP | claimed |
| US-20240199916-A1 | A CHARACTERISTIC STUDY OF ACRYLIC POLYMER DISPERSANT COATED ON SURFACE OF POLISHING PARTICLE | HANNAM UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATION (KR) | 2024-06-20 | — | — | US | claimed |
| CN-114867802-B | Slurry composition for polishing organic film | 凯斯科技股份有限公司 | 2024-02-20 | — | — | CN | claimed |
| CN-114957510-B | Functionalized modified polydextrose sorbitol carboxymethyl ether and preparation method thereof | 西安超磁纳米生物科技有限公司 | 2023-07-04 | — | — | CN | claimed |
| CN-113260687-B | CMP slurry composition for polishing polysilicon and polishing method using the same | 凯斯科技股份有限公司 | 2023-05-30 | — | — | CN | claimed |
| US-20230033789-A1 | SLURRY COMPOSITION FOR POLISHING ORGANIC FILM | KCTECH CO., LTD. (KR) | 2023-02-02 | — | — | US | claimed |
| CN-113260687-A | CMP slurry composition for polishing polysilicon and polishing method using the same | 凯斯科技股份有限公司 | 2021-08-13 | — | — | CN | claimed |
| WO-2021125919-A1 | SLURRY COMPOSITION FOR POLISHING ORGANIC FILM | 주식회사 케이씨텍 | 2021-06-24 | — | — | WO | claimed |
| US-20210009859-A1 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION FOR POLISHING MULTIPLE FILMS AND POLISHING METHOD USING THE SAME | KCTECH CO., LTD. (KR) | 2021-01-14 | — | — | US | claimed |
| CN-112210301-A | Chemical mechanical polishing slurry composition for polishing multilayer film | 凯斯科技股份有限公司 | 2021-01-12 | — | — | CN | claimed |
| WO-2020138717-A1 | CMP SLURRY COMPOSITION FOR POLISHING POLYCRYSTALLINE SILICON AND POLISHING METHOD USING SAME | 주식회사 케이씨텍 | 2020-07-02 | — | — | WO | claimed |
| US-9123660-B2 | Chemical mechanical polishing slurry compositions and polishing method using the same | CHEIL INDUSTRIES INC. (KR) | 2015-09-01 | — | — | US | claimed |
| US-20120282775-A1 | Chemical Mechanical Polishing Slurry Compositions and Polishing Method Using the Same | CHEIL INDUSTRIES INC. (KR) | 2012-11-08 | — | — | US | claimed |
| WO-2011081503-A2 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITIONS AND POLISHING METHOD USING THE SAME | CHEIL INDUSTRIES INC. (KR) | 2011-07-07 | — | — | WO | claimed |
| US-20090229189-A1 | METHOD FOR PREPARING A POLISHING SLURRY HAVING HIGH DISPERSION STABILITY | SAMSUNG CORNING CO., LTD. | 2009-09-17 | — | — | US | claimed |
| US-20060213126-A1 | Method for preparing a polishing slurry having high dispersion stability | SAMSUNG CORNING PRECISION GLASS CO., LTD. (KR) | 2006-09-28 | — | — | US | claimed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12545810-B2 | Magnetic polishing slurry and method for polishing a workpiece | CHKB, SMARCE1, SIK2 | DPP4 4559/4885F2 1652/4885L3MBTL1 3538/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.