SCHEMBL21891709

SCHEMBL21891709

O=C(O)c1ccccc1C(=O)N1CCC(O)CC1

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CPB1 P15086 1/20 0.68
ALDH1A1 P00352 4/20 0.61
L3MBTL1 Q9Y468 2/20 0.57
TP53BP1 Q12888 1/20 0.57
L3MBTL3 Q96JM7 1/20 0.57
GRM5 P41594 1/20 0.55
RAB9A P51151 1/20 0.54
MEN1 O00255 1/20 0.53
USP2 O75604 1/20 0.53
TSHR P16473 1/20 0.53
KMT2A Q03164 1/20 0.53
EPHX1 P07099 2/20 0.52
EPHX2 P34913 2/20 0.52
RECQL P46063 1/20 0.52
ALOX15 P16050 1/20 0.48
HRH1 P35367 1/20 0.48
CCR3 P51677 1/20 0.48
CYP2C9 P11712 3/20 0.48
CYP2C19 P33261 3/20 0.48
MAPK14 Q16539 3/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21891703 0.90 CPB1 (0.60) CPB1ALDH1A1L3MBTL1TP53BP1L3MBTL3
SCHEMBL16026538 0.85 ALDH1A1 (0.79) CPB1ALDH1A1L3MBTL1TP53BP1L3MBTL3
SCHEMBL4827189 0.82 ALDH1A1 (0.69) CPB1ALDH1A1L3MBTL1TP53BP1L3MBTL3
SCHEMBL9867716 0.81 MEN1 (0.67) ALDH1A1L3MBTL1MEN1TSHRKMT2A
SCHEMBL14163321 0.81 L3MBTL3 (0.68) CPB1ALDH1A1L3MBTL1TP53BP1L3MBTL3
SCHEMBL4003986 0.80 GRM5 (0.73) ALDH1A1L3MBTL1L3MBTL3GRM5MEN1
SCHEMBL16051336 0.80 ALDH1A1 (0.67) CPB1ALDH1A1L3MBTL1TP53BP1L3MBTL3
SCHEMBL21891701 0.80 CPB1 (0.59) CPB1ALDH1A1L3MBTL1TP53BP1L3MBTL3
SCHEMBL15533384 0.79 ALDH1A1 (0.48) CPB1ALDH1A1L3MBTL1KMT2AALOX15
SCHEMBL10723485 0.77 ALDH1A1 (0.62) CPB1ALDH1A1L3MBTL1TP53BP1L3MBTL3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020054226-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2020-03-19 WO disclosed