Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.59 |
| ▸ | NAPRT | Q6XQN6 | 2/20 | 0.59 |
| ▸ | DAO | P14920 | 1/20 | 0.59 |
| ▸ | HPGD | P15428 | 1/20 | 0.58 |
| ▸ | TP53 | P04637 | 1/20 | 0.57 |
| ▸ | SRD5A2 | P31213 | 4/20 | 0.56 |
| ▸ | CES2 | O00748 | 1/20 | 0.56 |
| ▸ | CES1 | P23141 | 1/20 | 0.56 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.50 |
| ▸ | CA1 | P00915 | 2/20 | 0.48 |
| ▸ | CA2 | P00918 | 2/20 | 0.48 |
| ▸ | CA12 | O43570 | 1/20 | 0.48 |
| ▸ | CA3 | P07451 | 1/20 | 0.48 |
| ▸ | TYR | P14679 | 1/20 | 0.48 |
| ▸ | DRD1 | P21728 | 1/20 | 0.48 |
| ▸ | CA4 | P22748 | 1/20 | 0.48 |
| ▸ | CA6 | P23280 | 1/20 | 0.48 |
| ▸ | CA5A | P35218 | 1/20 | 0.48 |
| ▸ | CA7 | P43166 | 1/20 | 0.48 |
| ▸ | CA9 | Q16790 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10476977 | 1.00 | TSHR (0.59) | TSHRNAPRTDAOHPGDTP53 | |
| SCHEMBL16749651 | 0.93 | TSHR (0.67) | TSHRNAPRTDAOHPGDTP53 | |
| SCHEMBL16772175 | 0.86 | BCL2L1 (0.58) | TSHRHPGDTP53SRD5A2CA1 | |
| SCHEMBL10029706 | 0.86 | ALDH1A1 (0.59) | HPGDSRD5A2CES2CES1NPC1 | |
| SCHEMBL10476981 | 0.85 | CA1 (0.69) | HPGDCES2CES1CA1CA2 | |
| SCHEMBL8535872 | 0.82 | CES2 (0.41) | TSHRNAPRTDAOHPGDTP53 | |
| SCHEMBL30485900 | 0.82 | HPGD (0.65) | TSHRNAPRTDAOHPGDTP53 | |
| SCHEMBL13703264 | 0.81 | ALDH1A1 (0.67) | TSHRHPGDTP53SRD5A2CES2 | |
| SCHEMBL10476991 | 0.80 | KMO (0.53) | TSHRNAPRTDAOHPGDSRD5A2 | |
| SCHEMBL1931860 | 0.80 | HPGD (0.63) | TSHRNAPRTDAOHPGDTP53 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117534836-A | Polybenzoxazole precursor, process for producing the same, and photosensitive resin composition | 上海交通大学 | 2024-02-09 | — | — | CN | claimed |
| CN-117534836-A | Polybenzoxazole precursor, process for producing the same, and photosensitive resin composition | 上海交通大学 | 2024-02-09 | — | — | CN | disclosed |
| WO-2023195202-A1 | HYBRID BONDING INSULATION FILM-FORMING MATERIAL, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | ＨＤマイクロシステムズ株式会社 | 2023-10-12 | — | — | WO | disclosed |
| US-20230221639-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-07-13 | — | — | US | disclosed |
| US-11640112-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-05-02 | — | — | US | disclosed |
| CN-110088680-B | Double-layer photosensitive layer roll | 旭化成株式会社 | 2022-12-30 | — | — | CN | disclosed |
| US-20220011669-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2022-01-13 | — | — | US | disclosed |
| US-11163234-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2021-11-02 | — | — | US | disclosed |
| US-11048167-B2 | Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2021-06-29 | — | — | US | disclosed |
| US-11021572-B2 | Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2021-06-01 | — | — | US | disclosed |
| EP-0387061-A2 | Novel polyamide-polyamide and polybenzoxazole-polyamide polymers | HOECHST CELANESE CORPORATION (US) | 1990-09-12 | — | — | EP | disclosed |
| US-4939215-A | CHEMICAL AND RADIATION RESISTANCE; AIRCRAFT, ELECTRONICS | HOECHST CELANESE CORPORATION (US) | 1990-07-03 | — | — | US | disclosed |
| US-4866155-A | HEAT, RADIATION RESISTANCE; TRANSPARENCY | HOECHST CELANESE CORPORATION (US) | 1989-09-12 | — | — | US | disclosed |
| EP-0323561-A2 | Polyesters of bis (2-(4-hydroxyphenyl) hexafluoroisopropyl)- diphenyl ether | HOECHST CELANESE CORPORATION (US) | 1989-07-12 | — | — | EP | disclosed |
| US-4845183-A | MOLDING MATERIALS; FOR DIELECTRICS OR COATING SOLUTIONS; TOUGHNESS, FLEXIBILITY, TRANSPARENT | HOECHST CELANESE CORPORATION (US) | 1989-07-04 | — | — | US | disclosed |
| EP-0317942-A2 | Heat resistant polyamides and polybenzoxazoles from bis-[(aminohydroxyphenyl hexafluoro-isopropyl] diphenyl ethers | HOECHST CELANESE CORPORATION (US) | 1989-05-31 | — | — | EP | disclosed |
| EP-0317940-A2 | Polycarbonamides of bis (2-(4-carboxyphenyl)hexafluoroisopropyl) - diphenyl ether | HOECHST CELANESE CORPORATION (US) | 1989-05-31 | — | — | EP | disclosed |
| US-4822868-A | Polycarbonamide of bis(2-(4-carboxyphenyl)-hexafluoroisopropyl)diphenyl ether | HOECHST CELANESE CORPORATION (US) | 1989-04-18 | — | — | US | disclosed |
| US-4671957-A | POVIDONE-IODINE FOR BURNS AND SKIN DISORDERS FUNGICIDES, VIRICIDES | EUROCELTIQUE, S.A. (LU) | 1987-06-09 | — | — | US | disclosed |
| EP-0185490-A2 | Antibacterial cream | Euroceltique S.A. (LU) | 1986-06-25 | — | — | EP | disclosed |