SCHEMBL22004479

SCHEMBL22004479

O=CCCC(=O)Nc1ccc(-c2ccc(-c3ccccc3)cc2)cc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 4/20 0.60
HDAC2 Q92769 4/20 0.60
HDAC3 O15379 3/20 0.60
HDAC4 P56524 3/20 0.60
HDAC7 Q8WUI4 3/20 0.60
HDAC10 Q969S8 3/20 0.60
HDAC11 Q96DB2 3/20 0.60
HDAC8 Q9BY41 3/20 0.60
HDAC6 Q9UBN7 3/20 0.60
HDAC9 Q9UKV0 3/20 0.60
HDAC5 Q9UQL6 3/20 0.60
ALDH1A1 P00352 3/20 0.60
NPC1 O15118 1/20 0.60
MITF O75030 1/20 0.60
HTT P42858 1/20 0.60
RAB9A P51151 1/20 0.60
SMN1; SMN2 Q16637 1/20 0.60
TP53 P04637 1/20 0.54
MEN1 O00255 4/20 0.54
KMT2A Q03164 4/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8582253 0.90 L3MBTL1 (0.62) HDAC1HDAC2HDAC3HDAC4HDAC7
SCHEMBL10441109 0.81 CYP1A2 (0.54) ALDH1A1MAPTCYP1A1
SCHEMBL6820308 0.79 GAA (0.57) ALDH1A1HTTRAB9ASMN1; SMN2TP53
SCHEMBL6462546 0.79 HDAC3 (0.58) HDAC1HDAC2HDAC3HDAC6ALDH1A1
SCHEMBL28102785 0.79 HDAC8 (0.62) HDAC1HDAC2HDAC3HDAC4HDAC7
SCHEMBL8789169 0.79 HDAC1 (0.64) HDAC1HDAC2HDAC3HDAC4HDAC7
SCHEMBL6820154 0.79 ALDH1A1 (0.60) ALDH1A1NPC1HTTRAB9ASMN1; SMN2
SCHEMBL6820003 0.79 POLB (0.64) HDAC1HDAC2HDAC3HDAC4HDAC7
SCHEMBL20303351 0.78 WNT3A (0.48) HDAC1HDAC2HDAC3HDAC4HDAC7
SCHEMBL13356363 0.78 MAPT (0.80) HDAC1HDAC2HDAC3HDAC4HDAC7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3653575-A1 SURFACE-MODIFIED INORGANIC NITRIDE, COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE PROVIDED WITH THERMALLY CONDUCTIVE LAYER FUJIFILM Corporation (JP) 2020-05-20 EP disclosed