SCHEMBL2203151

SCHEMBL2203151

CCN(CC)c1ccc(C=C2CN(C)CC(=Cc3ccc(N(CC)CC)cc3)C2=O)cc1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACHE P22303 2/20 0.57
PTGS2 P35354 1/20 0.57
BCHE P06276 1/20 0.55
MEN1 O00255 6/20 0.52
KMT2A Q03164 6/20 0.52
ALDH1A1 P00352 6/20 0.52
MAPT P10636 4/20 0.52
HTT P42858 3/20 0.52
SMN1; SMN2 Q16637 2/20 0.52
KDM4E B2RXH2 2/20 0.50
ALDH3A1 P30838 1/20 0.50
ALDH1A3 P47895 1/20 0.50
RAB9A P51151 2/20 0.49
NPC1 O15118 1/20 0.49
DRD3 P35462 1/20 0.48
LMNA P02545 4/20 0.48
GSK3B P49841 1/20 0.48
MITF O75030 1/20 0.48
NPSR1 Q6W5P4 2/20 0.47
HPGD P15428 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2203150 1.00 ACHE (0.57) ACHEPTGS2BCHEMEN1KMT2A
SCHEMBL8374810 0.87 DRD3 (0.58) ACHEPTGS2MEN1KMT2AALDH1A1
SCHEMBL8377306 0.87 ALDH1A1 (0.58) ACHEMEN1KMT2AALDH1A1MAPT
SCHEMBL51252 0.84 CYP1A2 (0.58) ACHEPTGS2BCHEMEN1KMT2A
SCHEMBL2847156 0.84 CYP1A2 (0.58) ACHEPTGS2BCHEMEN1KMT2A
SCHEMBL51253 0.84 CYP1A2 (0.58) ACHEPTGS2BCHEMEN1KMT2A
SCHEMBL29099922 0.84 CYP1A2 (0.58) ACHEPTGS2BCHEMEN1KMT2A
SCHEMBL8780590 0.83 ALDH1A1 (0.50) ACHEMEN1KMT2AALDH1A1MAPT
SCHEMBL17054697 0.83 CYP1A2 (0.66) ACHEPTGS2BCHEMEN1KMT2A
SCHEMBL8372688 0.83 CYP1A2 (0.66) ACHEPTGS2BCHEMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 80 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7153631-B2 Pattern-forming process using photosensitive resin composition HITACHI CHEMICAL CO., LTD. (JP) 2006-12-26 US claimed
EP-0551697-B1 Photoinitiator system and photopolymerizable composition using the same HITACHI CHEMICAL CO LTD (JP) 1997-05-14 EP claimed
EP-0551697-A1 Photoinitiator system and photopolymerizable composition using the same HITACHI CHEMICAL CO., LTD. (JP) 1993-07-21 EP claimed
US-5034429-A An unsaturated monomer, a photoinitiator and a benzene derivative for providing a cured film HITACHI CHEMICAL CO., LTD. (JP) 1991-07-23 US claimed
US-4415621-A COATING A SUBSTRATE WITH AN AMORPHOUS BINDER AND DYE; TELEVISION; DISCS; ABSORPTION EASTMAN KODAK COMPANY (US) 1983-11-15 US claimed
WO-2026100734-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
WO-2026100079-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
US-12601970-B2 Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component HD MICROSYSTEMS, LTD. (JP) 2026-04-14 US disclosed
US-20250341777-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT RESONAC CORP (JP) 2025-11-06 US disclosed
US-20250271757-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT RESONAC CORPORATION (JP) 2025-08-28 US disclosed
WO-2025099883-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2025-05-15 WO disclosed
WO-2025095080-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED PATTERN PRODUCT, AND CURED PRODUCT 株式会社レゾナック 2025-05-08 WO disclosed
EP-0295044-B1 PHOTOINITIATOR AND PHOTOPOLYMERIZABLE COMPOSITION USING THE SAME Hitachi Chemical Co., Ltd. (JP) 1992-04-22 EP disclosed
US-4987057-A HIGH SENSITIVITY TO VISIBLE LIGHT RAYS HITACHI CHEMICAL CO., LTD. (JP) 1991-01-22 US disclosed
EP-0373952-A2 Photosensitive resin composition and photosensitive element using the same Hitachi Chemical Co., Ltd. (JP) 1990-06-20 EP disclosed
EP-0295044-A2 Photoinitiator and photopolymerizable composition using the same Hitachi Chemical Co., Ltd. (JP) 1988-12-14 EP disclosed
US-4626361-A Binder-mixtures for optical recording layers and elements EASTMAN KODAK COMPANY (US) 1986-12-02 US disclosed
US-4499165-A COMPATABILITY; STABILITY; LASERS; DATA PROCESSING EASTMAN KODAK COMPANY (US) 1985-02-12 US disclosed
EP-0118881-A2 Binder-mixtures for optical recording layers and elements EASTMAN KODAK COMPANY (a New Jersey corporation) (US) 1984-09-19 EP disclosed
US-4415621-A COATING A SUBSTRATE WITH AN AMORPHOUS BINDER AND DYE; TELEVISION; DISCS; ABSORPTION EASTMAN KODAK COMPANY (US) 1983-11-15 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12601970-B2 Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component ARCN1, P4HA1, COL1A1 ACHE 4692/4885PTGS2 1412/4885BCHE 3151/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.