SCHEMBL2211208

SCHEMBL2211208

Sc1nc(S)n(-c2ccccc2)n1

nearest known ligand 0.37

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 2/20 0.37
MAPK1 P28482 2/20 0.37
CYP1A2 P05177 1/20 0.37
CYP2C19 P33261 1/20 0.37
MAPT P10636 1/20 0.37
TSHR P16473 1/20 0.37
KDM4E B2RXH2 3/20 0.37
HPGD P15428 2/20 0.37
POLB P06746 1/20 0.36
NPC1 O15118 2/20 0.36
RAB9A P51151 2/20 0.36
FCGR1A P12314 1/20 0.36
KDM4A O75164 1/20 0.36
ALDH1A1 P00352 2/20 0.35
LMNA P02545 1/20 0.35
HTT P42858 1/20 0.35
MPO P05164 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10401729 0.79 SMN1; SMN2 (0.43) SMN1; SMN2MAPK1CYP1A2CYP2C19MAPT
SCHEMBL10560957 0.79 KDM4A (0.41) SMN1; SMN2MAPK1CYP1A2CYP2C19MAPT
SCHEMBL11510201 0.79 MAPK1 (0.43) SMN1; SMN2MAPK1CYP1A2CYP2C19KDM4E
SCHEMBL10361051 0.79 KDM4A (0.41) SMN1; SMN2MAPK1CYP1A2CYP2C19MAPT
SCHEMBL533349 0.78 SMN1; SMN2 (0.57) SMN1; SMN2CYP1A2CYP2C19MAPTTSHR
SCHEMBL20994591 0.78 NPC1 (0.43) SMN1; SMN2NPC1RAB9AKDM4A
SCHEMBL10561774 0.72 USP2 (0.43) MAPK1MAPTTSHRKDM4EHPGD
SCHEMBL13139674 0.69 KHK (0.46) SMN1; SMN2MAPK1MAPTTSHRPOLB
SCHEMBL13139204 0.69 HTR3A (0.51) POLB
SCHEMBL11338369 0.69 LMNA (0.57) SMN1; SMN2MAPK1MAPTTSHRKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2906640-B1 COATING/SEALANT SYSTEMS, AQUEOUS RESINOUS DISPERSIONS, METHODS FOR MAKING AQUEOUS RESINOUS DISPERSIONS, AND METHODS OF ELECTROCOATING PRC DESOTO INT INC (US) 2017-11-15 EP disclosed
CN-104797663-B Coating/sealant system, aqueous resinous dispersion, method of making aqueous resinous dispersion, and electrocoating process PRC-迪索托国际公司 2017-08-25 CN disclosed
EP-2756043-B1 COATING/SEALANT SYSTEMS, AQUEOUS RESINOUS DISPERSIONS, AND METHODS OF ELECTROCOATING PRC DESOTO INT INC (US) 2017-04-12 EP disclosed
CN-103814092-B Coating/sealant systems, water-base resin matter dispersion, and electropaining method PRC-迪索托国际公司 2016-10-12 CN disclosed
US-9181628-B2 Coating/sealant systems, aqueous resinous dispersions, and methods of electrocoating PRC-DESOTO INTERNATIONAL, INC. (US) 2015-11-10 US disclosed
CN-104797663-A Coating/sealant system, aqueous resinous dispersion, method of making aqueous resinous dispersion, and electrocoating process PRC DESOTO INT INC 2015-07-22 CN disclosed
US-9029437-B2 Coating/sealant systems, aqueous resinous dispersions, methods for making aqueous resinous dispersions, and methods of electrocoating PRC-DESOTO INTERNATIONAL, INC. (US) 2015-05-12 US disclosed
CN-103814092-A Coating/sealant systems, aqueous resinous dispersions, and methods of electrocoating PRC DESOTO INT INC 2014-05-21 CN disclosed
EP-1952918-B1 METHOD FOR PRODUCING METAL PARTICLE DISPERSION, CONDUCTIVE INK USING METAL PARTICLE DISPERSION PRODUCED BY SUCH METHOD, AND CONDUCTIVE COATING FILM TOYO INK MFG CO (JP) 2013-05-22 EP disclosed
US-8440110-B2 Method for producing metal particle dispersion, conductive ink using metal particle dispersion produced by such method, and conductive coating film TOYO INK MFG CO., LTD. (JP) 2013-05-14 US disclosed
US-20130065057-A1 COATING/SEALANT SYSTEMS, AQUEOUS RESINOUS DISPERSIONS, AND METHODS OF ELECTROCOATING PRC-DESOTO INTERNATIONAL, INC. (US) 2013-03-14 US disclosed
CN-101287566-B Method for producing metal microparticle dispersion, conductive ink using metal microparticle dispersion produced by the method, and conductive coating film TOYO INK MFG CO 2012-05-23 CN disclosed
US-20110175040-A1 METHOD FOR PRODUCING METAL PARTICLE DISPRESION, CONDUCTIVE INK USING METAL PARTICLE DISPERSION PRODUCED BY SUCH METHOD, AND CONDUCTIVE COATING FILM TOYO INK MFG CO., LTD. (JP) 2011-07-21 US disclosed
US-7981327-B2 Method for producing metal particle dispersion, conductive ink using metal particle dispersion produced by such method, and conductive coating film TOYO INK MFG. CO. LTD. (JP) 2011-07-19 US disclosed
US-20090258202-A1 Method for Producing Metal Particle Dispersion, Conductive Ink Using Metal Particle Dispersion Produced by Such Method, and Conductive Coating Film GVP GESELLSCHAFT ZUR VERMARKTUNG DER PORENBRENNERTECHNIK MBH (DE) 2009-10-15 US disclosed
CN-101287566-A Method for producing metal microparticle dispersion, conductive ink using metal microparticle dispersion produced by the method, and conductive coating film TOYO INK MFG CO (JP) 2008-10-15 CN disclosed
EP-1952918-A1 METHOD FOR PRODUCING METAL PARTICLE DISPERSION, CONDUCTIVE INK USING METAL PARTICLE DISPERSION PRODUCED BY SUCH METHOD, AND CONDUCTIVE COATING FILM Toyo Ink Mfg. Co., Ltd (JP) 2008-08-06 EP disclosed
US-4357446-A CROSSLINKING AGENT IS 2,3-DIMERCAPTO-PYRAZINE OR-QUINOXALINE OSAKA SODA CO. LTD. (JP) 1982-11-02 US disclosed
US-4342851-A WITH A 2,4-DITHIOHYDANTOIN CROSSLINKING AGENT OSAKA SODA CO. LTD. (JP) 1982-08-03 US disclosed
US-4234705-A 3,5-DIMERCAPTO-1,2,4-TRIAZOLES OSAKA SODA CO. LTD. (JP) 1980-11-18 US disclosed