Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 15/20 | 0.64 |
| ▸ | FAAH | O00519 | 6/20 | 0.61 |
| ▸ | HSP90AA1 | P07900 | 2/20 | 0.49 |
| ▸ | PKM | P14618 | 2/20 | 0.49 |
| ▸ | MEN1 | O00255 | 1/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.49 |
| ▸ | LMNA | P02545 | 1/20 | 0.49 |
| ▸ | HPGD | P15428 | 1/20 | 0.49 |
| ▸ | HTT | P42858 | 1/20 | 0.49 |
| ▸ | CCR6 | P51684 | 1/20 | 0.49 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.49 |
| ▸ | ATM | Q13315 | 1/20 | 0.49 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.44 |
| ▸ | GSK3A | P49840 | 1/20 | 0.42 |
| ▸ | GSK3B | P49841 | 1/20 | 0.42 |
| ▸ | NR1H3 | Q13133 | 1/20 | 0.42 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28310904 | 0.95 | MGLL (0.69) | MGLLFAAHHSP90AA1PKMMEN1 | |
| SCHEMBL486996 | 0.93 | MGLL (0.68) | MGLLFAAHHSP90AA1PKMMEN1 | |
| SCHEMBL27174528 | 0.91 | MGLL (0.72) | MGLLFAAHHSP90AA1PKMMEN1 | |
| SCHEMBL8852774 | 0.89 | MGLL (0.80) | MGLLFAAHHSP90AA1PKMMEN1 | |
| SCHEMBL27951835 | 0.89 | MGLL (0.73) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL8402814 | 0.88 | MGLL (0.83) | MGLLFAAHHSP90AA1PKMMEN1 | |
| SCHEMBL8048971 | 0.87 | MGLL (0.81) | MGLLFAAHHSP90AA1PKMMEN1 | |
| SCHEMBL28560706 | 0.87 | MGLL (0.60) | MGLLFAAHHSP90AA1PKMMEN1 | |
| SCHEMBL10693565 | 0.86 | MGLL (0.55) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL349106 | 0.86 | MGLL (0.78) | MGLLFAAHHSP90AA1PKMMEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110198968-A | Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board | 三菱瓦斯化学株式会社 | 2019-09-03 | — | — | CN | claimed |
| CN-110121530-A | Resin combination, prepreg, plywood, clad with metal foil plywood, printed circuit board and multilayer board | 三菱瓦斯化学株式会社 | 2019-08-13 | — | — | CN | claimed |
| CN-110114407-A | Resin composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | 三菱瓦斯化学株式会社 | 2019-08-09 | — | — | CN | claimed |
| CN-117597372-A | Novel (meth) acrylamide polymer, resin composition containing the same, and molded article thereof | 日本曹达株式会社 | 2024-02-23 | — | — | CN | disclosed |
| CN-117597371-A | Novel polymer, resin composition containing the same, and molded article thereof | 日本曹达株式会社 | 2024-02-23 | — | — | CN | disclosed |
| CN-112745654-B | Resin composition and product thereof | 台光电子材料股份有限公司 | 2023-03-28 | — | — | CN | disclosed |
| CN-115298231-A | Resin particle, conductive material, and connection structure | 积水化学工业株式会社 | 2022-11-04 | — | — | CN | disclosed |
| CN-113717522-A | Resin composition and product thereof | 台光电子材料股份有限公司 | 2021-11-30 | — | — | CN | disclosed |
| CN-109749440-B | Cyanate ester resin composition and use thereof | 广东生益科技股份有限公司 | 2021-08-27 | — | — | CN | disclosed |
| CN-112745654-A | Resin composition and product thereof | 台光电子材料股份有限公司 | 2021-05-04 | — | — | CN | disclosed |
| WO-2020162278-A1 | COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, AND PRINTED WIRING BOARD | 三菱瓦斯化学株式会社 | 2020-08-13 | — | — | WO | disclosed |
| CN-110198968-A | Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board | 三菱瓦斯化学株式会社 | 2019-09-03 | — | — | CN | disclosed |
| CN-110139893-A | Prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | 三菱瓦斯化学株式会社 | 2019-08-16 | — | — | CN | disclosed |
| CN-110121531-A | Resin composition for printed circuit board, prepreg, resin sheet, plywood, clad with metal foil plywood, printed circuit board and multilayer board | 三菱瓦斯化学株式会社 | 2019-08-13 | — | — | CN | disclosed |
| CN-110121530-A | Resin combination, prepreg, plywood, clad with metal foil plywood, printed circuit board and multilayer board | 三菱瓦斯化学株式会社 | 2019-08-13 | — | — | CN | disclosed |
| CN-110114407-A | Resin composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | 三菱瓦斯化学株式会社 | 2019-08-09 | — | — | CN | disclosed |
| CN-108431133-B | Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board | 三菱瓦斯化学株式会社 | 2019-06-14 | — | — | CN | disclosed |