SCHEMBL486996

SCHEMBL486996

O=C1C=CC(=O)N1c1ccc(Oc2ccc(CCc3ccc(Oc4ccc(N5C(=O)C=CC5=O)cc4)cc3)cc2)cc1

nearest known ligand 0.68

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 15/20 0.68
FAAH O00519 6/20 0.60
HSP90AA1 P07900 2/20 0.51
PKM P14618 2/20 0.51
MEN1 O00255 1/20 0.51
ALDH1A1 P00352 1/20 0.51
LMNA P02545 1/20 0.51
HPGD P15428 1/20 0.51
HTT P42858 1/20 0.51
CCR6 P51684 1/20 0.51
KMT2A Q03164 1/20 0.51
ATM Q13315 1/20 0.51
NR1H3 Q13133 2/20 0.47
MAPK1 P28482 1/20 0.47
NPSR1 Q6W5P4 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
GSK3A P49840 1/20 0.45
GSK3B P49841 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22325656 0.93 MGLL (0.64) MGLLFAAHHSP90AA1PKMMEN1
SCHEMBL28310904 0.91 MGLL (0.69) MGLLFAAHHSP90AA1PKMMEN1
SCHEMBL28560706 0.90 MGLL (0.60) MGLLFAAHHSP90AA1PKMMEN1
SCHEMBL8048971 0.90 MGLL (0.81) MGLLFAAHHSP90AA1PKMMEN1
SCHEMBL349106 0.89 MGLL (0.78) MGLLFAAHHSP90AA1PKMMEN1
SCHEMBL331752 0.88 MGLL (0.84) MGLLFAAHHSP90AA1PKMMEN1
SCHEMBL487033 0.88 MGLL (0.84) MGLLFAAHHSP90AA1PKMMEN1
SCHEMBL4385482 0.88 MGLL (0.84) MGLLFAAHHSP90AA1PKMMEN1
SCHEMBL4388793 0.88 MGLL (0.77) MGLLFAAHHSP90AA1PKMALDH1A1
SCHEMBL27174528 0.87 MGLL (0.72) MGLLFAAHHSP90AA1PKMMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 124 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119490747-A Resin composition, prepreg comprising same, laminated board and metal foil-clad laminated board 广东生益科技股份有限公司 2025-02-21 CN claimed
CN-116410595-B Resin composition, prepreg comprising same, and metal foil-clad laminate 广东生益科技股份有限公司 2025-02-14 CN claimed
CN-116410596-B Resin composition and application thereof 广东生益科技股份有限公司 2025-02-14 CN claimed
CN-118256088-A Resin composition and application thereof 广东生益科技股份有限公司 2024-06-28 CN claimed
CN-118240342-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 CN claimed
CN-116410594-B Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2024-06-14 CN claimed
CN-116496199-A Modified maleimide compound and application thereof 广东生益科技股份有限公司 2023-07-28 CN claimed
CN-116410595-A Resin composition, prepreg comprising same, and metal foil-clad laminate 广东生益科技股份有限公司 2023-07-11 CN claimed
CN-116410594-A Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2023-07-11 CN claimed
CN-116410596-A Resin composition and application thereof 广东生益科技股份有限公司 2023-07-11 CN claimed
US-20260071011-A1 COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2026-03-12 US disclosed
US-20250326893-A1 RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2025-10-23 US disclosed
US-20250326929-A1 RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2025-10-23 US disclosed
US-20250287499-A1 PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORPORATION (JP) 2025-09-11 US disclosed
US-20250188263-A1 RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2025-06-12 US disclosed
US-20050100738-A1 Resin composition, prepreg and laminate using the composition MITSUI CHEMICALS, INC. (JP) 2005-05-12 US disclosed
US-20050095434-A1 Resin composition, prepreg and laminate using the composition MITSUI CHEMICALS, INC. (JP) 2005-05-05 US disclosed
EP-0471522-B1 Resin composition based on polymaleimide and phenolic aralkyl resin MITSUI TOATSU CHEMICALS (JP) 1995-12-13 EP disclosed
US-5266654-A Polymaleimide, phenolic resin with xylylene groups, epoxy resin MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1993-11-30 US disclosed
EP-0471522-A1 Resin composition based on polymaleimide and phenolic aralkyl resin MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-02-19 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260071011-A1 COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE CD79B, C1R, TGFBR1 MGLL 3867/4885FAAH 4069/4885HSP90AA1 3849/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.