SCHEMBL27174528

SCHEMBL27174528

CCCCc1ccc(Oc2ccc(N3C(=O)C=CC3=O)cc2)cc1

nearest known ligand 0.72

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MGLL Q99685 10/20 0.72
▸ FAAH O00519 3/20 0.72
▸ ALDH1A1 P00352 2/20 0.44
▸ HSP90AA1 P07900 2/20 0.44
▸ HPGD P15428 2/20 0.44
▸ HTT P42858 2/20 0.44
▸ MEN1 O00255 1/20 0.44
▸ LMNA P02545 1/20 0.44
▸ PKM P14618 1/20 0.44
▸ CCR6 P51684 1/20 0.44
▸ KMT2A Q03164 1/20 0.44
▸ ATM Q13315 1/20 0.44
▸ NPBWR1 P48145 1/20 0.44
▸ CACNA1B Q00975 1/20 0.43
▸ APBA1 Q02410 1/20 0.43
▸ NPSR1 Q6W5P4 1/20 0.43
▸ TDP1 Q9NUW8 1/20 0.43
▸ GSK3A P49840 1/20 0.42
▸ GSK3B P49841 1/20 0.42
▸ NR1H3 Q13133 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8852774 0.95 MGLL (0.80) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL8402814 0.94 MGLL (0.83) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL8048971 0.91 MGLL (0.81) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL22325656 0.91 MGLL (0.64) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL1087192 0.91 MGLL (0.87) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL28310904 0.89 MGLL (0.69) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL27856088 0.88 MGLL (0.56) MGLLFAAHALDH1A1HSP90AA1HTT
SCHEMBL486996 0.87 MGLL (0.68) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL3482538 0.85 MGLL (0.97) MGLLFAAHALDH1A1HSP90AA1LMNA
SCHEMBL8853360 0.84 MGLL (0.79) MGLLFAAHALDH1A1HSP90AA1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118256088-A Resin composition and application thereof 广东生益科技股份有限公司 2024-06-28 — — CN claimed
CN-118240342-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 — — CN claimed
CN-118240341-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 — — CN claimed
CN-116410594-B Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2024-06-14 — — CN claimed
CN-116496199-A Modified maleimide compound and application thereof 广东生益科技股份有限公司 2023-07-28 — — CN claimed
CN-116410594-A Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2023-07-11 — — CN claimed
CN-116410596-A Resin composition and application thereof 广东生益科技股份有限公司 2023-07-11 — — CN claimed
CN-116410595-A Resin composition, prepreg comprising same, and metal foil-clad laminate 广东生益科技股份有限公司 2023-07-11 — — CN claimed
CN-118256088-A Resin composition and application thereof 广东生益科技股份有限公司 2024-06-28 — — CN disclosed
CN-118240342-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 — — CN disclosed
CN-118240341-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 — — CN disclosed
CN-116410594-B Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2024-06-14 — — CN disclosed
US-20240092958-A1 THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND HIGH-SPEED COMMUNICATION COMPATIBLE MODULE RESONAC CORPORATION (JP) 2024-03-21 — — US disclosed
CN-116496199-A Modified maleimide compound and application thereof 广东生益科技股份有限公司 2023-07-28 — — CN disclosed
CN-103328543-B Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same HITACHI CHEMICAL CO LTD 2015-07-15 — — CN disclosed
CN-103328578-B Resin composition, and printed wiring board, laminated sheet, and prepreg using same HITACHI CHEMICAL CO LTD 2015-06-17 — — CN disclosed
CN-103626959-A Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same HITACHI CHEMICAL CO LTD 2014-03-12 — — CN disclosed
CN-102344816-B Liquid crystal alignment agent, liquid crystal alignment film prepared from same and liquid crystal display element CHI MEI CORP 2014-02-19 — — CN disclosed
CN-102365310-B Thermosetting resin composition, and prepreg, insulating film with support, laminate, and printed wiring board using same HITACHI CHEMICAL CO LTD 2013-11-20 — — CN disclosed
CN-102365310-A Thermosetting resin composition, and prepreg, insulating film with support, laminate, and printed wiring board using same HITACHI CHEMICAL CO LTD 2012-02-29 — — CN disclosed
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