SCHEMBL225570

SCHEMBL225570

CC=CC(=O)OCCCc1ccc(-n2nc3ccccc3n2)c(O)c1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MET P08581 8/20 0.43
APP P05067 3/20 0.42
AKR1B10 O60218 7/20 0.42
AKR1B1 P15121 7/20 0.42
ALOX5 P09917 2/20 0.41
LMNA P02545 2/20 0.36
NPC1 O15118 1/20 0.36
RAB9A P51151 1/20 0.36
KDM4E B2RXH2 1/20 0.35
MEN1 O00255 1/20 0.35
GMNN O75496 1/20 0.35
ALDH1A1 P00352 1/20 0.35
EGFR P00533 1/20 0.35
TTR P02766 1/20 0.35
ESR1 P03372 1/20 0.35
ERBB2 P04626 1/20 0.35
LCK P06239 1/20 0.35
FYN P06241 1/20 0.35
CYP3A4 P08684 1/20 0.35
MAPT P10636 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7270250 0.92 MET (0.46) METAPPAKR1B10AKR1B1ALOX5
SCHEMBL22129610 0.85 APP (0.49) METAPPAKR1B10AKR1B1ALOX5
SCHEMBL7268057 0.83 ALOX5 (0.44) METAKR1B10AKR1B1ALOX5LMNA
SCHEMBL7737134 0.82 ALOX5 (0.41) METAKR1B10AKR1B1ALOX5NPC1
SCHEMBL29370022 0.82 NPC1 (0.37) METAPPLMNANPC1RAB9A
SCHEMBL225569 0.82 NPC1 (0.37) METAPPLMNANPC1RAB9A
SCHEMBL226212 0.81 NPC1 (0.35) APPAKR1B1LMNANPC1RAB9A
SCHEMBL7262236 0.81 ALOX5 (0.40) METAKR1B10AKR1B1ALOX5NPC1
SCHEMBL21647319 0.80 ALOX5 (0.41) METAKR1B10AKR1B1ALOX5LMNA
SCHEMBL3951413 0.79 MET (0.41) METAPPAKR1B10AKR1B1ALOX5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 374 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260139087-A1 COMPOUND, POLYMER, LIGHT STABILIZER COMPOSITION, RESIN COMPOSITION, COATING MATERIAL COMPOSITION, ARTICLE, SEALING MATERIAL, MOLDED ARTICLE, METHOD FOR PRODUCING WEATHER-RESISTANT RESIN COMPOSITION, AND METHOD FOR IMPROVING WEATHER RESISTANCE OF SYNTHETIC RESIN ADEKA CORPORATION (JP) 2026-05-21 US disclosed
EP-4745198-A1 RESIN COMPOSITION, MOLDED ARTICLE, RESIN ADDITIVE COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, METHOD FOR IMPROVING CRYSTALLINITY OF CRYSTALLINE RESIN, AND MATERIAL FOR RESIN ADDITIVE COMPOSITION ADEKA CORPORATION (JP) 2026-05-20 EP disclosed
US-12577376-B2 Molded articles with laser-formed pattern Celanese Interntaional Corporation (US) 2026-03-17 US disclosed
US-12577355-B2 Polyester polymer compositions CELANESE SALES GERMANY GMBH (DE) 2026-03-17 US disclosed
US-20260002014-A1 RESIN COMPOSITION AND MOLDED ARTICLE THEREOF ADEKA CORPORATION (JP) 2026-01-01 US disclosed
EP-3578161-B1 METHOD FOR IMPROVING STORAGE STABILITY OF COSMETIC ADEKA CORP (JP) 2025-11-12 EP disclosed
US-12466938-B2 Resin additive composition, thermoplastic resin composition, and molded article thereof ADEKA CORPORATION (JP) 2025-11-11 US disclosed
US-12435205-B2 Resin composition and molded article thereof ADEKA CORPORATION (JP) 2025-10-07 US disclosed
EP-4130197-B1 FLAME RETARDANT COMPOSITION, FLAME-RESISTANT SYNTHETIC RESIN COMPOSITION, AND MOLDED BODY ADEKA CORP (JP) 2025-10-01 EP disclosed
US-20250282947-A1 Polyester Polymer Composition Containing Low Friction Aid CELANESE POLYMERS HOLDING, INC. 2025-09-11 US disclosed
US-20040099849-A1 Ultraviolet absorber for synthetic resin and synthetic resin composition containing the same ADEKA CORPORATION (JP) 2004-05-27 US disclosed
EP-1384749-A1 ULTRAVIOLET ABSORBER FOR SYNTHETIC RESIN AND SYNTHETIC RESIN COMPOSITION CONTAINING THE SAME Asahi Denka Kogyo K. K. (JP) 2004-01-28 EP disclosed
EP-1375582-A2 Nucleating agent and crystalline polymer composition containing the same Asahi Denka Co., Ltd. (JP) 2004-01-02 EP disclosed
US-20030236329-A1 Nucleating agent and crystalline polymer composition containing the same ASAHI DENKA CO., LTD. (JP) 2003-12-25 US disclosed
US-20030162870-A1 Flame-retardant resin composition ASAHI DENKA CO., LTD. (JP) 2003-08-28 US disclosed
US-20030125432-A1 Granular composite additive for polyolefin, process for producing the same, and polyolefin composition containing the same ADEKA CORPORATION (JP) 2003-07-03 US disclosed
EP-1304350-A1 Flame-retardant resin composition Asahi Denka Co., Ltd. (JP) 2003-04-23 EP disclosed
EP-1266932-A1 GRANULAR COMPOSITE ADDITIVE FOR POLYOLEFIN, PROCESS FOR PRODUCING THE SAME, AND POLYOLEFIN COMPOSITION CONTAINING THE SAME ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 2002-12-18 EP disclosed
US-6432875-B1 LOW MOLECULAR WEIGHT POLYESTER ASAHI DENKA KOGYO K.K. (JP) 2002-08-13 US disclosed
EP-0987122-A1 THERMAL RECORDING MATERIAL ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 2000-03-22 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12577376-B2 Molded articles with laser-formed pattern LAS1L, PIM2, YES1 MET 262/4885APP 1809/4885AKR1B10 4697/4885
US-12577355-B2 Polyester polymer compositions SMCHD1, PWWP2B, USP30 MET 415/4885APP 1542/4885AKR1B10 4507/4885
US-20260002014-A1 RESIN COMPOSITION AND MOLDED ARTICLE THEREOF NXF1, NOP2, RTF1 MET 4296/4885APP 2527/4885AKR1B10 2537/4885
US-20260139087-A1 COMPOUND, POLYMER, LIGHT STABILIZER COMPOSITION, RESIN COMPOSITION, COATING MATERIAL COMPOSITION, ARTICLE, SEALING MATERIAL, MOLDED ARTICLE, METHOD FOR PRODUCING WEATHER-RESISTANT RESIN COMPOSITION, AND METHOD FOR IMPROVING WEATHER RESISTANCE OF SYNTHETIC RESIN SEM1, RAD51, SUN2 MET 2462/4885APP 1434/4885AKR1B10 3324/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.