SCHEMBL226212

SCHEMBL226212

CC=CC(=O)OCC(O)Cc1ccc(-n2nc3ccccc3n2)c(O)c1

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 5/20 0.35
RAB9A P51151 5/20 0.35
LMNA P02545 2/20 0.35
KDM4E B2RXH2 7/20 0.33
MAPT P10636 6/20 0.33
TDP1 Q9NUW8 5/20 0.33
HPGD P15428 5/20 0.33
ALDH1A1 P00352 4/20 0.33
SMN1; SMN2 Q16637 2/20 0.33
NPSR1 Q6W5P4 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
POLB P06746 4/20 0.33
APP P05067 2/20 0.32
MMP1 P03956 2/20 0.32
MMP2 P08253 1/20 0.32
MMP3 P08254 1/20 0.32
MMP9 P14780 1/20 0.32
MMP12 P39900 1/20 0.32
MMP13 P45452 1/20 0.32
GAA P10253 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29373449 0.82 NPC1 (0.36) NPC1RAB9ALMNAKDM4EMAPT
SCHEMBL226211 0.82 NPC1 (0.36) NPC1RAB9ALMNAKDM4EMAPT
SCHEMBL225570 0.81 MET (0.43) NPC1RAB9ALMNAKDM4EMAPT
SCHEMBL7999286 0.77 MMP1 (0.39) NPC1RAB9ALMNAKDM4EMAPT
SCHEMBL3632449 0.77 NPC1 (0.38) NPC1RAB9ALMNAKDM4EMAPT
SCHEMBL20494778 0.76 NPC1 (0.48) NPC1RAB9ALMNAKDM4EHPGD
SCHEMBL8002383 0.76 HPGD (0.43) LMNAKDM4EMAPTTDP1HPGD
SCHEMBL27786785 0.76 CA2 (0.43) NPC1RAB9ALMNAKDM4EMAPT
SCHEMBL22129610 0.74 APP (0.49) NPC1RAB9ALMNAKDM4EMAPT
SCHEMBL5276524 0.74 CA12 (0.44) AKR1B1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 390 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260139087-A1 COMPOUND, POLYMER, LIGHT STABILIZER COMPOSITION, RESIN COMPOSITION, COATING MATERIAL COMPOSITION, ARTICLE, SEALING MATERIAL, MOLDED ARTICLE, METHOD FOR PRODUCING WEATHER-RESISTANT RESIN COMPOSITION, AND METHOD FOR IMPROVING WEATHER RESISTANCE OF SYNTHETIC RESIN ADEKA CORPORATION (JP) 2026-05-21 US disclosed
EP-4745198-A1 RESIN COMPOSITION, MOLDED ARTICLE, RESIN ADDITIVE COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, METHOD FOR IMPROVING CRYSTALLINITY OF CRYSTALLINE RESIN, AND MATERIAL FOR RESIN ADDITIVE COMPOSITION ADEKA CORPORATION (JP) 2026-05-20 EP disclosed
US-12577355-B2 Polyester polymer compositions CELANESE SALES GERMANY GMBH (DE) 2026-03-17 US disclosed
US-12577376-B2 Molded articles with laser-formed pattern Celanese Interntaional Corporation (US) 2026-03-17 US disclosed
US-20260002014-A1 RESIN COMPOSITION AND MOLDED ARTICLE THEREOF ADEKA CORPORATION (JP) 2026-01-01 US disclosed
EP-3578161-B1 METHOD FOR IMPROVING STORAGE STABILITY OF COSMETIC ADEKA CORP (JP) 2025-11-12 EP disclosed
US-12466938-B2 Resin additive composition, thermoplastic resin composition, and molded article thereof ADEKA CORPORATION (JP) 2025-11-11 US disclosed
US-12435205-B2 Resin composition and molded article thereof ADEKA CORPORATION (JP) 2025-10-07 US disclosed
EP-4130197-B1 FLAME RETARDANT COMPOSITION, FLAME-RESISTANT SYNTHETIC RESIN COMPOSITION, AND MOLDED BODY ADEKA CORP (JP) 2025-10-01 EP disclosed
US-20250282947-A1 Polyester Polymer Composition Containing Low Friction Aid CELANESE POLYMERS HOLDING, INC. 2025-09-11 US disclosed
EP-0987122-B1 THERMAL RECORDING MATERIAL ASAHI DENKA KOGYO KK (JP) 2004-08-04 EP disclosed
US-20040099849-A1 Ultraviolet absorber for synthetic resin and synthetic resin composition containing the same ADEKA CORPORATION (JP) 2004-05-27 US disclosed
EP-1375582-A2 Nucleating agent and crystalline polymer composition containing the same Asahi Denka Co., Ltd. (JP) 2004-01-02 EP disclosed
US-20030236329-A1 Nucleating agent and crystalline polymer composition containing the same ASAHI DENKA CO., LTD. (JP) 2003-12-25 US disclosed
US-20030162870-A1 Flame-retardant resin composition ASAHI DENKA CO., LTD. (JP) 2003-08-28 US disclosed
US-20030125432-A1 Granular composite additive for polyolefin, process for producing the same, and polyolefin composition containing the same ADEKA CORPORATION (JP) 2003-07-03 US disclosed
EP-1304350-A1 Flame-retardant resin composition Asahi Denka Co., Ltd. (JP) 2003-04-23 EP disclosed
EP-1266932-A1 GRANULAR COMPOSITE ADDITIVE FOR POLYOLEFIN, PROCESS FOR PRODUCING THE SAME, AND POLYOLEFIN COMPOSITION CONTAINING THE SAME ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 2002-12-18 EP disclosed
US-6432875-B1 LOW MOLECULAR WEIGHT POLYESTER ASAHI DENKA KOGYO K.K. (JP) 2002-08-13 US disclosed
EP-0987122-A1 THERMAL RECORDING MATERIAL ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 2000-03-22 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12577376-B2 Molded articles with laser-formed pattern LAS1L, PIM2, YES1 NPC1 3955/4885RAB9A 4207/4885LMNA 2140/4885
US-12577355-B2 Polyester polymer compositions SMCHD1, PWWP2B, USP30 NPC1 4460/4885RAB9A 2876/4885LMNA 2775/4885
US-20260002014-A1 RESIN COMPOSITION AND MOLDED ARTICLE THEREOF NXF1, NOP2, RTF1 NPC1 554/4885RAB9A 4015/4885LMNA 1042/4885
US-20260139087-A1 COMPOUND, POLYMER, LIGHT STABILIZER COMPOSITION, RESIN COMPOSITION, COATING MATERIAL COMPOSITION, ARTICLE, SEALING MATERIAL, MOLDED ARTICLE, METHOD FOR PRODUCING WEATHER-RESISTANT RESIN COMPOSITION, AND METHOD FOR IMPROVING WEATHER RESISTANCE OF SYNTHETIC RESIN SEM1, RAD51, SUN2 NPC1 821/4885RAB9A 2000/4885LMNA 1525/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.