SCHEMBL2291379

SCHEMBL2291379

O=C(O)CC(c1ccccc1)(c1ccc(O)cc1)c1ccc(O)cc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MIF P14174 1/20 0.60
KIF11 P52732 6/20 0.54
CYP2C19 P33261 1/20 0.52
HIF1A Q16665 1/20 0.52
ESR1 P03372 3/20 0.50
ESR2 Q92731 3/20 0.50
ALDH1A1 P00352 2/20 0.50
CYP3A4 P08684 2/20 0.50
MDM4 O15151 1/20 0.47
MDM2 Q00987 1/20 0.47
FNTA P49354 1/20 0.42
FNTB P49356 1/20 0.42
CA2 P00918 2/20 0.42
CES2 O00748 1/20 0.42
CAMK2A Q9UQM7 1/20 0.42
LMNA P02545 1/20 0.42
CHRM2 P08172 1/20 0.40
CHRM4 P08173 1/20 0.40
CHRM1 P11229 1/20 0.40
CHRM3 P20309 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL503257 0.89 MIF (0.65) MIFKIF11CYP2C19HIF1AALDH1A1
SCHEMBL20546665 0.87 MIF (0.63) MIFKIF11CYP2C19HIF1AALDH1A1
SCHEMBL7887393 0.82 CYP2C19 (0.60) MIFKIF11CYP2C19HIF1AALDH1A1
SCHEMBL11615834 0.82 MIF (0.89) MIFKIF11CYP2C19HIF1ACES2
SCHEMBL28305537 0.81 CYP2C19 (0.48) MIFKIF11CYP2C19HIF1AESR1
SCHEMBL370451 0.78 MIF (0.53) MIFKIF11CYP2C19HIF1AALDH1A1
SCHEMBL8413148 0.77 ESR1 (0.56) KIF11ESR1ESR2ALDH1A1CYP3A4
SCHEMBL28038488 0.76 ESR1 (0.46) MIFKIF11CYP2C19HIF1AESR1
SCHEMBL10664452 0.76 KIF11 (0.50) KIF11HIF1AESR1ESR2ALDH1A1
SCHEMBL69485 0.75 ESR1 (0.59) KIF11ESR1ESR2ALDH1A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8354359-B2 Heat-sensitive adhesive agent and heat-sensitive adhesive sheet RICOH COMPANY, LTD. (JP) 2013-01-15 US disclosed
US-8003568-B2 Excellent water resistance, superior transportability under high temperature and high humidity conditions, and appropriate sticking property under low temperature and low humidity conditions; protective layer comprises a diacetone-modified polyvinyl alcohol resin and a (meth)acrylic resin RICOH COMPANY, LTD. (JP) 2011-08-23 US disclosed
US-7811661-B2 Heat-sensitive adhesive material RICOH COMPANY, LTD. (JP) 2010-10-12 US disclosed
EP-1816003-B1 Method for producing a thermosensitive recording material RICOH KK (JP) 2009-08-26 EP disclosed
US-20080280757-A1 Thermosensitive recording material RICOH COMPANY, LTD. (JP) 2008-11-13 US disclosed
EP-1634936-B1 Heat-sensitive adhesive material RICOH KK (JP) 2008-08-06 EP disclosed
US-20080176012-A1 Heat-sensitive adhesive agent and heat-sensitive adhesive sheet RICOH COMPANY, LTD. (JP) 2008-07-24 US disclosed
EP-1897925-A1 Heat-sensitive adhesive agent and heat-sensitive adhesive sheet Ricoh Company, Ltd. (JP) 2008-03-12 EP disclosed
US-20070184978-A1 Thermosensitive recording material and method of producing the same RICOH COMPANY, LTD. (JP) 2007-08-09 US disclosed
EP-1816003-A1 Thermosensitive recording material and method for producing the same Ricoh Company, Ltd. (JP) 2007-08-08 EP disclosed
US-20060068191-A1 Heat-sensitive adhesive material RICOH COMPANY, LTD. (JP) 2006-03-30 US disclosed
EP-1634936-A2 Heat-sensitive adhesive material Ricoh Company, Ltd. (JP) 2006-03-15 EP disclosed
US-5536697-A WATER, LIGHT AND CHEMICAL RESISTANCE RICOH COMPANY, LTD. (JP) 1996-07-16 US disclosed