Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PARP10 | Q53GL7 | 1/20 | 0.56 |
| ▸ | RAB9A | P51151 | 2/20 | 0.54 |
| ▸ | LMNA | P02545 | 2/20 | 0.54 |
| ▸ | HTT | P42858 | 1/20 | 0.54 |
| ▸ | PAX8 | Q06710 | 1/20 | 0.54 |
| ▸ | ATM | Q13315 | 1/20 | 0.54 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.54 |
| ▸ | NPC1 | O15118 | 2/20 | 0.53 |
| ▸ | PLK1 | P53350 | 1/20 | 0.53 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.50 |
| ▸ | HPGD | P15428 | 2/20 | 0.50 |
| ▸ | TSHR | P16473 | 1/20 | 0.50 |
| ▸ | PLA2G4B | P0C869 | 1/20 | 0.50 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.50 |
| ▸ | TAS1R3 | Q7RTX0 | 1/20 | 0.49 |
| ▸ | TAS1R1 | Q7RTX1 | 1/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.49 |
| ▸ | CES2 | O00748 | 2/20 | 0.49 |
| ▸ | CES1 | P23141 | 2/20 | 0.49 |
| ▸ | NQO1 | P15559 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30887385 | 1.00 | PARP10 (0.56) | PARP10RAB9ALMNAHTTPAX8 | |
| SCHEMBL11557533 | 0.87 | TP53 (0.55) | SMN1; SMN2TSHRPLA2G4BL3MBTL1 | |
| SCHEMBL11373785 | 0.87 | L3MBTL1 (0.55) | RAB9ALMNASMN1; SMN2PLK1HPGD | |
| Benzoin SCHEMBL8853271 | 0.85 | LMNA (0.66) | RAB9ALMNAPAX8SMN1; SMN2NPC1 | |
| SCHEMBL6836761 | 0.83 | CES2 (0.46) | PARP10RAB9ALMNAHTTPAX8 | |
| SCHEMBL23053351 | 0.82 | AKR1C3 (0.55) | PARP10LMNASMN1; SMN2NPC1PLK1 | |
| SCHEMBL9195223 | 0.82 | AKR1C3 (0.55) | PARP10LMNASMN1; SMN2NPC1PLK1 | |
| SCHEMBL9427862 | 0.82 | AKR1C3 (0.55) | PARP10LMNASMN1; SMN2NPC1PLK1 | |
| SCHEMBL28799901 | 0.82 | PARP10 (0.59) | PARP10RAB9ALMNAHTTPAX8 | |
| Ether SCHEMBL158383 | 0.82 | CA1 (0.47) | RAB9AHTTSMN1; SMN2NPC1HPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230272188-A1 | ADDITIVE COMPOSITION, RESIN COMPOSITION CONTAINING SAME, AND MOLDED ARTICLE OF SAID RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2023-08-31 | — | — | US | disclosed |
| EP-4183827-A1 | ADDITIVE COMPOSITION, RESIN COMPOSITION CONTAINING SAME, AND MOLDED ARTICLE OF SAID RESIN COMPOSITION | ADEKA CORPORATION (JP) | 2023-05-24 | — | — | EP | disclosed |
| US-8354359-B2 | Heat-sensitive adhesive agent and heat-sensitive adhesive sheet | RICOH COMPANY, LTD. (JP) | 2013-01-15 | — | — | US | disclosed |
| EP-2397531-B1 | Heat-sensitive adhesive material | RICOH CO LTD (JP) | 2012-10-31 | — | — | EP | disclosed |
| EP-2062953-B1 | Heat-sensitive adhesive material | RICOH CO LTD (JP) | 2011-08-17 | — | — | EP | disclosed |
| US-7993732-B2 | Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material | RICOH COMPANY, LTD. (JP) | 2011-08-09 | — | — | US | disclosed |
| US-7811661-B2 | Heat-sensitive adhesive material | RICOH COMPANY, LTD. (JP) | 2010-10-12 | — | — | US | disclosed |
| EP-2072597-A1 | Heat-Sensitive Adhesive and Heat-Sensitive Adhesive Material | Ricoh Company, Ltd. (JP) | 2009-06-24 | — | — | EP | disclosed |
| US-20090155569-A1 | HEAT-SENSITIVE ADHESIVE, AND HEAT-SENSITIVE ADHESIVE MATERIAL | RICOH COMPANY, LTD (JP) | 2009-06-18 | — | — | US | disclosed |
| EP-2062953-A1 | Heat-sensitive adhesive material | Ricoh Company, Ltd. (JP) | 2009-05-27 | — | — | EP | disclosed |
| US-20090130441-A1 | HEAT-SENSITIVE ADHESIVE MATERIAL | RICOH COMPANY, LTD (JP) | 2009-05-21 | — | — | US | disclosed |
| EP-1634936-B1 | Heat-sensitive adhesive material | RICOH KK (JP) | 2008-08-06 | — | — | EP | disclosed |
| US-20080176012-A1 | Heat-sensitive adhesive agent and heat-sensitive adhesive sheet | RICOH COMPANY, LTD. (JP) | 2008-07-24 | — | — | US | disclosed |
| EP-1897925-A1 | Heat-sensitive adhesive agent and heat-sensitive adhesive sheet | Ricoh Company, Ltd. (JP) | 2008-03-12 | — | — | EP | disclosed |
| US-20080026205-A1 | Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material | RICOH COMPANY, LTD. (JP) | 2008-01-31 | — | — | US | disclosed |
| EP-1882726-A1 | Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material | Ricoh Company, Ltd. (JP) | 2008-01-30 | — | — | EP | disclosed |
| US-20060068191-A1 | Heat-sensitive adhesive material | RICOH COMPANY, LTD. (JP) | 2006-03-30 | — | — | US | disclosed |
| EP-1634936-A2 | Heat-sensitive adhesive material | Ricoh Company, Ltd. (JP) | 2006-03-15 | — | — | EP | disclosed |
| US-4013643-A | N,N-DISUBSTITUTED 2,3-DIPHENYLALLYLAMINES | G. D. SEARLE & CO. (US) | 1977-03-22 | — | — | US | disclosed |
| US-3937722-A | PHOTOSENSITIZERS, IRRADIATION POLYMERIZATION, CROSSLINKING | BAYER AG (DT) | 1976-02-10 | — | — | US | disclosed |